Low optical-loss facet preparation for silica-on-silicon photonics using the ductile dicing regime

Low optical-loss facet preparation for silica-on-silicon photonics using the ductile dicing regime
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使用延性切割方案进行硅基硅光子学的低光损耗刻面制备

DOI:
10.1088/0022-3727/46/47/475103
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发表时间:
2013
期刊:
影响因子:
--
通讯作者:
Carpenter L
Carpenter L
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--
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--
作者:
Carpenter L

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用于低损耗耦合的高质量刻面的有效生产是集成光学中的重要生产问题,通常需要耗时且人工密集的研磨和抛光步骤,这大大增加了器件制造成本。精密切割锯与金刚石浸渍刀片的发展,使光学级表面加工的晶体材料,如锂碳酸盐和石榴石。在这份报告中,我们研究了切割机参数的优化,以获得光学质量的表面在硅上硅平面器件表现出高的光学质量,在商业上重要的玻璃质材料。我们实现了4.9 nm(Sa)的表面粗糙度使用优化的切割条件。通过在波导上加工凹槽,使用优化的切割参数,基于光栅的损耗测量技术被用于精确地测量由于表面粗糙度引起的散射引起的每个面的平均自由空间界面损耗。每个面的平均界面损耗计算为:TE和TM偏振分别为− 0.63 dB和− 0.76 dB。
The efficient production of high-quality facets for low-loss coupling is a significant production issue in integrated optics, usually requiring time consuming and manually intensive lapping and polishing steps, which add considerably to device fabrication costs. The development of precision dicing saws with diamond impregnated blades has allowed optical grade surfaces to be machined in crystalline materials such as lithium niobate and garnets. In this report we investigate the optimization of dicing machine parameters to obtain optical quality surfaces in a silica-on-silicon planar device demonstrating high optical quality in a commercially important glassy material. We achieve a surface roughness of 4.9 nm (Sa) using the optimized dicing conditions. By machining a groove across a waveguide, using the optimized dicing parameters, a grating based loss measurement technique is used to measure precisely the average free space interface loss per facet caused by scattering as a consequence of surface roughness. The average interface loss per facet was calculated to be:− 0.63 dB and− 0.76 dB for the TE and TM polarizations, respectively.
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