Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz
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高效计算高达 500 GHz 的硅通孔建模的局域场

DOI:
10.1109/tcpmt.2015.2490601
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发表时间:
2015
期刊:
IEEE Transactions on Components, Packaging and Manufacturing Technology
影响因子:
--
通讯作者:
Christian Schuster
Christian Schuster
中科院分区:
--
文献类型:
--
作者:
David Dahl;Xiaomin Duan;Ivan Ndip;Klaus-Dieter Lang;Christian Schuster

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本文介绍了在硅中介层的垂直互连的局部(近)场的建模方法和这些方法的应用,通过硅通孔结构的电磁特性的有效计算。局域场是由于这些结构中存在的同轴到径向波导结的模式转换。由于精确的分析技术只存在于均匀填充的结,本文提出了一种有效的数值技术建模的非均匀的情况。该技术以具有三个端口的网络参数的形式提供准确的结果,其可以应用于,例如,在基于物理的通孔模型的框架内。旋转对称情况下的频域有限差分法适用于沿轴向和径向坐标沿着的可变网格距离,并实现了硅和电隔离二氧化硅的非均匀填充的界面条件。该方法进行了验证与全波的结果,从有限元模拟和与出版的分析方法,适用于分层结构的结果。主要的重点是从趋肤效应在大约100 MHz到100 GHz之间发展良好的频率进行信号完整性分析的建模。尽管如此,良好的协议,从有限元模拟的结果高达500 GHz的几个相关的示例结构,并实现了至少两个订单相比,有限元模拟的加速比。
This paper presents methods for the modeling of the localized (near) fields of vertical interconnects in silicon interposers and the applications of these methods for the efficient computation of the electromagnetic properties of through silicon via structures. The localized fields are due to the mode conversions of the coaxial-to-radial waveguide junctions present in these structures. Because exact analytical techniques exist only for the homogeneously filled junction, an efficient numerical technique is proposed in this paper for the modeling of the inhomogeneous cases. This technique provides accurate results in the form of network parameters with three ports, which can be applied, e.g., in the framework of the physics-based via models. The finite-difference frequency domain method for the case of rotational symmetry is adapted to variable grid distances along the axial and radial coordinates, and interface conditions for the inhomogeneous filling of silicon and electrically isolating silicon dioxide are implemented. The method is validated with full-wave results from finite-element simulations and with the results from the published analytical methods that are adapted to the layered structures. The main focus is in the modeling for signal integrity analysis from the frequencies where the skin effect is well developed at about 100 MHz up to 100 GHz. Nevertheless, good agreement with the results from finite-element simulations up to 500 GHz is obtained for several relevant example structures, and a speedup of at least two orders compared with the finite-element simulations is achieved.
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