Effects of scratching directions on AFM-based abrasive abrasion process
Effects of scratching directions on AFM-based abrasive abrasion process
复制标题
划痕方向对基于 AFM 的磨料磨损过程的影响
DOI：
10.1016/j.triboint.2008.05.011
复制
发表时间：
2009
影响因子：
6.2
通讯作者：
Dong, S.
中科院分区：
文献类型：
--
作者：
Yan, Y. D.;Sun, T.;Liang, Y. C.;Dong, S.
基于 AFM 的单磨料磨损工艺广泛应用于表面微/纳米加工，用于制造纳米级结构。磨损深度和粗糙度在这些结构的应用中非常重要。为了研究划痕方向对磨损深度和磨痕内粗糙度的影响，利用带有金字塔形金刚石尖端的原子力显微镜对抛光单晶硅表面进行单槽划痕试验和磨损试验。单槽划痕测试表明尖端几何形状导致不同的去除状态，例如切割和犁耕。在相同的载荷下，使用垂直于悬臂长轴而不是平行于悬臂长轴的刮擦方向产生更深的磨损深度和更粗糙的表面。相对于垂直于悬臂长轴的进给刮擦，表面粗糙度减小，而沿悬臂长轴刮擦时，小进给时表面粗糙度更粗糙。这是由于悬臂沿不同刮擦方向的刚度不同以及针尖和样品之间的去除状态不同。
AFM-based single abrasive abrasion process is widely employed in the surface micro/nanomachining for fabrication of structures at the nanometer scale. The wear depth and roughness are significantly important in the application of these structures. To study effects of scratching directions on the wear depth and roughness within the wear mark, single groove scratching test and wear test on the surface of polished single crystal silicon were carried out using AFM with a pyramidal diamond tip. Single groove scratching tests indicated that tip geometry leads to different removal states such as cutting and plowing. At the same load, deeper wear depth and rougher surface were produced by using the scratching direction perpendicular to the long axis of the cantilever rather than parallel to the long axis of the cantilever. Surface roughness decreases with respect to the feed scratching perpendicular to the long axis of the cantilever, whereas while scratching along the long axis of the cantilever, the surface roughness is rougher at the small feed. This is attributed to the different stiffness of the cantilever along different scratching directions and different removal states between the tip and sample.
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DOI：
--
发表时间：
2003-02
期刊：
--
影响因子：
--
作者：
Y. Ichida;Y. Morimoto;M. Murakami;R. Sato
通讯作者：
Y. Ichida;Y. Morimoto;M. Murakami;R. Sato
影响因子：
1.6
作者：
S. Tegen;B. Kracke;B. Damaschke
通讯作者：
S. Tegen;B. Kracke;B. Damaschke
影响因子：
3.5
作者：
Notargiacomo, A;Foglietti, V;Nicolini, C
通讯作者：
Nicolini, C
DOI：
10.1007/s00542-002-0193-7
发表时间：
2002-09
期刊：
Microsystem Technologies
影响因子：
--
作者：
Jin-Eui Lee;I. Sung;Dae-Eun Kim
通讯作者：
Jin-Eui Lee;I. Sung;Dae-Eun Kim
影响因子：
5
作者：
Zhaoguo Jiang;Chung-Jen Lu;D. Bogy;T. Miyamoto
通讯作者：
Zhaoguo Jiang;Chung-Jen Lu;D. Bogy;T. Miyamoto