Selective structuring of multi-layer functional thin films using a laser-induced shockwave delamination process

Selective structuring of multi-layer functional thin films using a laser-induced shockwave delamination process
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使用激光诱导冲击波分层工艺选择性结构化多层功能薄膜

DOI:
10.1117/12.2212495
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发表时间:
2016
期刊:
影响因子:
--
通讯作者:
K. Zimmer
K. Zimmer
中科院分区:
--
文献类型:
--
作者:
M. Ehrhardt;P. Lorenz;L. Bayer;C. Molpeceres;C. A. H. Ramirez;K. Zimmer

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激光辅助薄膜微结构化,尤其适用于电子应用,而不影响多层系统的功能,例如:由于熔化产品对激光微加工技术来说是一个挑战。使用冲击波诱导薄膜分层 (SWIFD) 图案化研究了不锈钢载体箔上铜铟镓硒 (CIGS) 太阳能电池的 P2 划片。分层过程是由载体箔背面激光烧蚀产生的冲击波引起的。在本研究中,KrF 准分子激光器提供的 UV 纳秒激光脉冲用于诱导 SWIFD 过程。通过光学和扫描电子显微镜(SEM)根据各种激光照射参数研究了所获得的薄膜结构的形态和尺寸。此外,通过能量色散X射线光谱(EDX)分析激光图案化后的材料成分。通过高速阴影图实验分析了 SWIFD 过程中涉及的过程的时间序列。本研究的结果表明,根据所使用的激光参数,存在大的工艺窗口,其中可以从基板上去除CIGS薄膜,而无需对CIGS薄膜进行可见的热改性。
The laser assisted micro structuring of thin films especially for electronic applications without influence the functionality of the multi-layer system e.g. due to melting products is a challenge for the laser micro machining techniques. The P2 scribing of copper indium gallium selenide (CIGS) solar cells on stainless steel carrier foil was studied using shockwave- induced film delamination (SWIFD) patterning. The delamination process is induced by a shock wave generated by the laser ablation of the rear side of the carrier foil. In the present study UV nanosecond laser pulses provided by a KrF excimer laser were used to induce the SWIFD process. The morphology and size of the achieved thin-film structures were studied in dependence on various laser irradiation parameters by optical and scanning electron microscopy (SEM). Furthermore, the materials composition after the laser patterning was analyzed by energy dispersive X-ray spectroscopy (EDX). The temporal sequences of processes involved in the SWIFD process were analyzed with high speed shadowgraph experiments. The results of the present study shows that in dependence on the laser parameter used a large process window exist in which the CIGS thin film can be removed from the substrate without visible thermal modification of the CIGS thin film.
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