Plasticity Promoted Band Structure Engineering Achieved by Arrayed Indentation on GaAs Wafers

Plasticity Promoted Band Structure Engineering Achieved by Arrayed Indentation on GaAs Wafers
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GaAs晶圆上阵列压痕实现塑性促进能带结构工程

DOI:
10.1002/adom.201600381
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发表时间:
2016-10
影响因子:
9
通讯作者:
Duo Liu
Duo Liu
中科院分区:
材料科学2区
文献类型:
--
作者:
Dongfang Zhao;Xiaoyu Lin;Ran Jia;Naikun Gao;Duo Liu

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半导体上的工程缺陷位点为设计具有本质上不可用的功能的新型光电器件提供了机会。证明可以通过阵列压痕在GaAs晶圆上制备复合光子晶体。压痕图案支持银纳米板的光化学培养,其新原理涉及可塑性促进带工程。它还提供了最初在砷化镓或银纳米结构中不具备的各种新颖功能。特别是,这种独特的结构表现出白光光致发光发射,在 375 nm 激光激发下,其强度足以被肉眼感知。这种可塑性介导的原理为设计和制造具有奇异特性的新型复合半导体/金属结构开辟了一条新途径。
Engineered defective sites on semiconductors offer opportunities for the design of novel optoelectronic devices with functions that are not intrinsically available. It is demonstrated that composite photonic crystal can be created on GaAs wafers by arrayed indentation. The indentation pattern supports photochemical cultivation of Ag nanoplates with a new principle involving plasticity promoted band engineering. It also provides a variety of novel functions not originally available in either GaAs or Ag nanostructures. In particular, this unique structure exhibits white light photoluminescence emission, strong enough to be perceived by the naked eye upon excitation with a 375 nm laser. This plasticity mediated principle opens a new avenue for the design and fabrication of novel composite semiconductor/metal structures with exotic properties.
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