AlN-Based Ceramic Patch Antenna-Type Wireless Passive High-Temperature Sensor.
AlN-Based Ceramic Patch Antenna-Type Wireless Passive High-Temperature Sensor.
复制标题
AlN 基陶瓷贴片天线型无线无源高温传感器。
DOI:
10.3390/mi8100301
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发表时间:
2017-10-10
期刊:
影响因子:
3.4
通讯作者:
Xiong J
中科院分区:
文献类型:
--
作者:
Yan D;Yang Y;Hong Y;Liang T;Yao Z;Chen X;Xiong J
An aluminum nitride (AlN) based patch antenna-type high-temperature wireless passive sensor is reported to operate as both a sensor and an antenna, which integrates in situ measurement/sensing with remote wireless communication at the same time. The sensor is small, easy to manufacture, highly sensitive and has a high operating temperature; it can be used in high-temperature, chemically corrosive and other harsh environments. The sensing mechanism of the sensor, the dielectric constant of the AlN ceramic substrate, increases with rising temperature, which reduces the resonant frequency of the sensor. Thus, the temperature can be measured by detecting changes in the sensor’s resonant frequency. High-Frequency Simulation Structure (HFSS) software is used to determine the structure and size of the sensor, which is then fabricated using thick-film technology. The substrate of the sensor is AlN ceramic due to its outstanding thermal resistance at high temperature; and its conductors (the radiation patch and the ground under the substrate) are silver-palladium alloy sintered form silver–palladium paste. A vector network analyzer reveals that the sensor’s operating range extends to 700 °C. Furthermore, its resonant frequency decreases from 2.20 GHz to 2.13 GHz with increasing temperature from room temperature (25 °C) to 700 °C, with an absolute sensitivity of 104.77 KHz/°C. Our work verifies the feasibility of measuring high temperatures using AlN-based patch antenna wireless passive temperature sensors, and provides a new material and temperature sensitive structure for high-temperature measurement in harsh environments.
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影响因子:
4.3
作者:
Binder, Alfred;Bruckner, Gudrun;Schmitt, Daniel
通讯作者:
Schmitt, Daniel
影响因子:
2.4
作者:
Deshmukh, S.;Huang, H.
通讯作者:
Huang, H.
影响因子:
11.2
作者:
Habib, Zehra;Parthasarathy, Ramkumar;Gollahalli, Subramanyam
通讯作者:
Gollahalli, Subramanyam
影响因子:
1.6
作者:
Nowak, Damian;Dziedzic, Andrzej
通讯作者:
Dziedzic, Andrzej
DOI:
10.1109/tchmt.1985.1136500
发表时间:
1985-01-01
期刊:
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
影响因子:
--
作者:
KUROKAWA, Y;UTSUMI, K;NOGUCHI, S
通讯作者:
NOGUCHI, S