Evaluating the interfacial toughness of GaN-on-diamond with an improved analysis using nanoindentation
Evaluating the interfacial toughness of GaN-on-diamond with an improved analysis using nanoindentation
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使用纳米压痕改进分析来评估金刚石基氮化镓的界面韧性
DOI:
10.1016/j.scriptamat.2021.114370
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发表时间:
2022
影响因子:
6
通讯作者:
Field D
中科院分区:
文献类型:
--
作者:
Field D
An improved analysis of the interfacial toughness using nanoindentation induced blistering of thin films on stiff substrates is demonstrated on GaN-on-diamond. The Hutchinson-Suo analysis requires accurate measurement of blister dimensions, conventionally measured using 2-D line-scans from 3-D topographical maps. The new meteorology overcomes shortcomings of this technique by fitting the 3-D analytical solution of a clamped Kicrchoff plate to the topological map of the blister. This allowed for quantification of interfacial toughness of smaller blisters in GaN-on-diamond, previously assumed invalid for analysis due to inadequacies of the line-scan analysis. Three samples were investigated and found to have interfacial toughness ranging from 0.6–1 J m−2. Additionally, the relationship between residual stress in the GaN and interfacial toughness was investigated using photoluminescence spectroscopy. In all cases, the GaN was found to be under increased compression at the diamond interface by up to -0.81 GPa, although no correlation with interfacial toughness was observed.
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影响因子:
9.5
作者:
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通讯作者:
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影响因子:
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影响因子:
4
作者:
Zhao, DG;Xu, SJ;Yang, H
通讯作者:
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作者:
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