Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria.
Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria.
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DOI：
10.1007/s00253-010-2980-x
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发表时间：
2011-03
影响因子：
5
通讯作者：
Rensing, Christopher
中科院分区：
文献类型：
--
作者：
Elguindi, Jutta;Moffitt, Stuart;Hasman, Henrik;Andrade, Cassandra;Raghavan, Srini;Rensing, Christopher
关键词：
与金属铜接触的各种细菌的快速杀灭被认为是受铜离子流入细胞的影响，但确切的机制尚未完全了解。这项研究表明，铜表面的接触杀灭动力学在很大程度上取决于存在的水分量，合金的铜含量，所使用的介质类型和细菌类型。我们研究了抗生素和铜离子耐药菌株大肠杆菌和屎肠球菌分离猪场后，使用硫酸铜作为饲料补充剂。结果表明，两种抗铜离子的大肠杆菌均能迅速致死。coli和E.当富介质中的样品以薄的潮湿层铺展在铜含量为85%或更高的铜合金上时，E.大肠杆菌菌株在干燥条件下迅速死亡，而E.屎肠菌株受影响较小。电镀铜表面的腐蚀速率测定从电化学极化测试使用的Stern-Geary方法，并显示降低腐蚀速率与苯并三唑和热氧化物涂层。抗铜离子E. coli和E.与未经防腐处理的表面相比，悬浮在0.8%NaCl中的屎细胞在具有苯并三唑涂层和热氧化物涂层的电镀铜表面上显示出延长的存活率。表面腐蚀的控制影响了铜离子流入细菌细胞的水平，这直接有助于细菌的杀灭。
The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by influx of copper ions into the cells but the exact mechanism is not fully understood. This study showed that the kinetics of contact-killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper-ion resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper-ion resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electro-chemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper-ion resistant E. coli and E. faecium cells suspended in 0.8% NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells which contributed directly to bacterial killing.
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影响因子：
3.3
作者：
Aarestrup, FM;Hasman, H
通讯作者：
Hasman, H
DOI：
10.1016/s0006-291x(02)00726-x
发表时间：
2002-07-19
影响因子：
3.1
作者：
Lee, SM;Grass, G;Brown, NL
通讯作者：
Brown, NL
影响因子：
4.9
作者：
Hasman, H;Aarestrup, FM
通讯作者：
Aarestrup, FM
影响因子：
4
作者：
Elguindi J;Wagner J;Rensing C
通讯作者：
Rensing C
影响因子：
6.9
作者：
Noyce, J. O.;Michels, H.;Keevil, C. W.
通讯作者：
Keevil, C. W.