Characterization of thin film Parylene C device curvature and the formation of helices via thermoforming.
Characterization of thin film Parylene C device curvature and the formation of helices via thermoforming.
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DOI：
10.1088/1361-6439/acdc33
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发表时间：
2023-09-01
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影响因子：
--
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中科院分区：
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在微制造生物医学装置中，柔性聚合物衬底变得越来越优选于刚性硅衬底，因为它们能够顺应生物组织。然而，这种装置以平面构造制造，这导致平面装置不紧密匹配大多数组织的形状。热成型是一种可以重塑热塑性聚合物的工艺，可用于将具有图案化金属特征的平坦薄膜聚合物器件转变为复杂的三维（3D）几何形状。这个过程扩展了平面微加工的使用，以实现可以与身体更紧密接触的3D形状。常见的形状包括球体，其可以符合视网膜的形状;锥体，其可以用作鞘以与插入管心针对接;以及螺旋，其可以缠绕在神经、血管、肌纤维周围，或者用作应变消除特征。这项工作的特点是弯曲的薄膜聚对二甲苯C设备与图案化的金属功能，建立不同的聚对二甲苯厚度和加工条件。器件曲率是由每个聚对二甲苯和金属层中的膜应力引起的，其通过实验和数学模型来表征，该数学模型估计器件几何形状和处理对曲率的影响。利用这种表征，开发了一种优化工艺，将具有图案化金属特征的薄膜Parylene C器件热成型为0.25 mm直径的螺旋，同时防止聚合物和金属破裂。
In microfabricated biomedical devices, flexible, polymer substrates are becoming increasingly preferred over rigid, silicon substrates because of their ability to conform to biological tissue. Such devices, however, are fabricated in a planar configuration, which results in planar devices that do not closely match the shape of most tissues. Thermoforming, a process which can reshape thermoplastic polymers, can be used to transform flat, thin film, polymer devices with patterned metal features into complex three-dimensional (3D) geometries. This process extends the use of planar microfabrication to achieve 3D shapes which can more closely interface with the body. Common shapes include spheres, which can conform to the shape of the retina; cones, which can be used as a sheath to interface with an insertion stylet; and helices, which can be wrapped around nerves, blood vessels, muscle fibers, or be used as strain relief feature. This work characterizes the curvature of thin film Parylene C devices with patterned metal features built with varying Parylene thicknesses and processing conditions. Device curvature is caused by film stress in each Parylene and metal layer, which is characterized experimentally and by a mathematical model which estimates the effects of device geometry and processing on curvature. Using this characterization, an optimized process to thermoform thin film Parylene C devices with patterned metal features into 0.25 mm diameter helices while preventing cracking in the polymer and metal was developed.
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影响因子：
4
作者：
Kim, B. J.;Kuo, J. T. W.;Meng, E.
通讯作者：
Meng, E.
影响因子：
3.4
作者：
Ortigoza-Diaz J;Scholten K;Larson C;Cobo A;Hudson T;Yoo J;Baldwin A;Weltman Hirschberg A;Meng E
通讯作者：
Meng E
影响因子：
2.1
作者：
Branger, V;Pelosin, V;Goudeau, P
通讯作者：
Goudeau, P
DOI：
10.1088/0960-1317/24/6/065003
发表时间：
2014-06-01
影响因子：
2.3
作者：
Kim, B. J.;Chen, B.;Meng, E.
通讯作者：
Meng, E.
影响因子：
2.1
作者：
DABRAL, S;VANETTEN, J;MCDONALD, JF
通讯作者：
MCDONALD, JF