Microlayer Polymeric Composites

本研究旨在研究微层（50至1000层）聚合物复合材料的加工-固态结构-性能关系。陶氏共挤出技术将用于微层系统的生产。广泛不同的固体结构和性质的聚合物将被组合成微层结构，从而产生具有每个组分所需特征的复合系统。在某些情况下，进一步的性能增强将在后处理过程中通过单轴和双轴取向来实现。这些复合系统的复杂行为将根据结构的层次进行分析。从这些相互作用的层次层次将阐明属性的依赖和进化。特别是，层厚度和层间附着力的影响将进行分析。为本研究选择的聚合物材料的选择，注意独特的优势，可以实现与微层工艺。具有耦合性质的坚韧结构，如选定的光透射或屏蔽，微分势垒和输运性质或压电响应，将被研究。通过使用微层处理高度不同的聚合物，结合固体结构和性能分析的分层方法，将研究一类新的聚合物复合系统。

This research aims to study processing--solid state structure-- property relationships in microlayer (50 to 1000 layers) polymeric composites. Dow coextrusion technology will be used for the production of microlayer systems. Polymers of widely dissimilar solid-state structures and properties will be combined into microlayer structures, thereby producing a composite system with the desirable features of each component. In some instances, further property enhancement will be achieved by uniaxial and biaxial orientation in a post-processing procedure. The complex behavior of these composite systems will be analyzed in terms of heirarchical levels of structure. The dependency and evolution of properties from these interactive hierarchical levels will be elucidated. In particular, the effects of layer thickness and adhesion between layers will be analyzed. Polymeric materials selected for this study are chosen with attention to unique advantages that are achievable with the microlayer process. Tough structures with coupled properties, such as selected light transmission or shielding, differential barrier and transport properties or piezoelectric response, will be investigated. By using microlayer processing of highly dissimilar polymers in combination with the hierarchical approach to solid-state structure and property analysis, a new class of polymeric composite systems will be examined.