Expedited Award for Novel Research: Fabrication of Micro Electro Mechanical Actuators and Motors

在硅片上集成微机械器件是一项新兴的技术。微机械设备，包括致动器、电机和传感器，预计将在机器人、仪器仪表、医学探测器、天基系统和传感器阵列中得到应用。最近的研究结果表明，可以使用改进的硅加工技术来制造运动部件，如齿轮、连杆和电机。这项拟议的研究旨在开发一种CVD硅钨技术，以制造用于执行器和马达的完全释放的、可移动的微结构。具体地说，本研究的目标包括：(1)开发钨硅技术以制造无应力、可移动的微结构，(2)利用钨硅技术制造具有10微米行程的线性静电致动器，(3)制造用于测量和表征钨硅微结构系统的摩擦和应力的测试结构，(4)制造直线微电机，以及(5)确定今后研究和开发微电子机械系统的关键科学技术问题。

The integration of micromechanical devices on silicon chips is an emerging technology. Micromechanical devices, including actuators, motors, and sensors, are projected to have applications in robotics, instrumentation, medical probes, space-based systems, and sensor arrays. Recent research results have shown that moving parts, such as gears, linkages, and motors, can be fabricated using modified silicon processing techniques. The proposed research seeks to develop a CVD tungsten-on-silicon technology to fabricate fully released, movable microstructures for actuators and motors. Specifically, the goals of this research include: (1) to develop a tungsten-silicon technology to produce stress-free, movable microstructures, (2) to fabricate a linear, electrostatic actuator with 10 micron travel using the tungsten-silicon technology, (3) to fabricate test structures to measure and characterize friction and stress for tungsten-silicon microstructure systems, (4) to fabricate a linear micromotor, and (5) to identify the key science and technology issues for future research and development of microelectromechanical systems.