Numerical Investigation of Flow Field and Cooling Enhancement in Electronic Chip Configurations

所提出的研究的目标是直接数值 共振激励强化传热数值模拟 流动中的Tollmien-Schlichting不稳定性， 用于电子设备的空气冷却。 共振激发将 通过施加频率等于 最不稳定的流动频率，并通过自发超临界 流动的不稳定性。 拟议的研究将解决 存在的浮力和三维问题， 电子冷却配置。 为了理解和 量化超临界和共振传热的物理学 增强，建议开发一种有效的流体动力热 基于直接模拟的传递数值代码 非平均三维能量和Navier-Stokes方程 谱元-傅里叶方法。 数值结果直接 模拟将允许验证和进一步发展传热 模型，因为计算建模仍然是一个基本的工具， 工程实践分析。

The objective of the proposed research is the direct numerical simulation of heat transfer enhancement by resonant excitation of Tollmien-Schlichting instabilities in flows such as those encountered in air cooling of electronic equipment. The resonant excitation will be achieved by imposing an external excitation at a frequency equal to the most unstable flow frequency, and by spontaneously supercritical destabilization of the flow. The proposed research will address the issues of buoyancy and three-dimensionality which are present in electronic cooling configurations. In order to understand and quantify the physics of supercritical and resonant heat transfer enhancement, it is proposed to develop an efficient hydrodynamic-heat transfer numerical code based on the direct simulation of the unaveraged three-dimensional energy and Navier-Stokes equations using a spectral element-Fourier method. The numerical results from direct simulations will permit to validate and further develop heat transfer models, since computational modeling is still a fundamental tool of analysis in engineering practice.