Novel Optical Interconnection Networks Using Optoelectronic Integrated Circuits

主要研究人员将设计并实验演示一种复杂而新颖的光子互连网络，该网络将光学输入和输出的二维阵列互连起来。该网络是一个通用的体积（散装）多级洗牌交换设计，使用高效的固定光互连和光电子集成电路（oeic）提供动态路由和信号再生。oeic是专门为实现在高带宽（100mhz）下传输数据所需的性能而设计的。信号的路由是由携带数据信号或光功率的光束上编码的偏振决定的。此外，电路经过优化，允许高密度的类似开关以二维阵列格式排列。因此，oeic将使用no.53 gao制造。pi已经发现它与非常低的功耗电路兼容，因此适合于高阵列电路密度。正在研究的系统的另一个特点是，它将使用集成的InP光伏电池为阵列元件提供光学（而不是电力）动力。光供电的优点是供电时阵列元件之间的电串扰较低，并且相对容易分布在高密度网络中，在高密度网络中，与远程像素的互连可能是一个重大问题。该项目涉及南加州大学两个小组之间的密切合作——一个小组的专业知识在互联架构设计领域得到了证明；另一家专门从事inp基材料oeic的设计和制造。成功完成项目目标所需的学科组合将导致光子互连网络最先进状态的重大进展。​此外，该计划还将与光电子行业合作，提高我们的能力，最终实现商业光子交换网络使用先进的设备技术，如这里提出的。

The Principal Investigators will design and experimentally demonstrate a sophisticated and novel photonic interconnection network that interconnects 2-D arrays of optical inputs and outputs. The network is a general volume (bulk) multistage shuffle exchange design using high efficiency fixed optical interconnections along with optoelectronic integrated circuits (OEICs) to provide dynamic routing and signal regeneration. The OEICs are designed specifically to attain the performance necessary to carry data at high bandwidths ( 100 MHz). The routing of signals is determined by the polarization encoded on the light beam on which the data signal or optical power is carried. Furthermore, the circuits are optimized to allow for a high density of similar switches arranged in a 2D array format. For this reason, the OEICs will be fabricated using Ino.53GaO.47As which has been found by the PIs to be compatible with very low power dissipation circuits, hence lending itself to high array circuit densities. Another feature of the system under investigation is that it will be optically (rather than electrically) powered using integrated InP photovoltaic cells for the array elements. Optical powering has the advantages of supplying power with a low level of electrical cross-talk between array elements, and is relatively easily distributed in high density networks where interconnection to remote pixels can be a significant problem. The program involves a close collaboration between two groups at USC -- one whose expertise has been demonstrated in the field of interconnection architecture design, and the other which specializes in the design and fabrication of OEICs in InP-based materials. The combination of disciplines necessary for the successful completion of the project goals will lead to significant advances in the state- of-the-art of photonic interconnection networks. Furthermore, this program is to be complemented by a partnership with photonics industry, enhancing our ability to eventually realize commercial photonic switching networks using advanced device technologies such as those proposed here.