Thermal Analysis of Printed-Wiring-Board (PWB) Forced Convective Cooling

这是向哥伦比亚特区大学(UDC)颁发的研究机会奖(ROA)，这是一个历史上的黑人机构。哥伦比亚特区大学将与马里兰大学计算机辅助生命周期工程(CALCE)工业/大学合作研究中心合作，开发一种交互式计算机程序，用于印刷线路板(PWB)冷却的热分析。UDC将使用最先进的知识来评估CALCE软件在PWB上的对流流动，测试软件，报告能力和限制，开发文档，并改进CALCE代码。项目主任建议，根据ROA计划，哥伦比亚特区大学在两(2)年内获得10万美元的奖励。其中50,000美元由工程基础设施发展司分担费用。

This is a Research Opportunity Award (ROA) to the University of the District of Columbia (UDC), an Historically Black Institution. The University of the District of Columbia, in cooperation with the Industry/University Cooperative Research Center for Computer Aided Life Cycle Engineering (CALCE) at the University of Maryland will develop an interactive computer program for thermal analysis of Printed Wiring Boards (PWB) cooling. The UDC will use state-of the-art knowledge to evaluate CALCE software for convective flow over PWB, test the software, report on capabilities and limitations, develop documentation, and improve the CALCE code. The Program Director recommends that the University of the District of Columbia be awarded $100,000 for two (2) years under the ROA Program. $50,000 of this award is cost shared by the Division of Infrastructure Development in Engineering.