U.S.-U.K. Cooperative Research: Theories for Coatings and Thin Films

该奖项支持美国西北大学（Northwestern University）的Leon M. Keer博士和robert博士在表面工程和摩擦学领域的合作研究。英国剑桥大学的K.L. Johnson和J.E. Field。目标是开发一种方法来测量基材上硬涂层的附着力，以获得最佳的抗磨损和分层能力，并开发一种理论模型来预测软薄膜的失效，例如硅上的铝。Keer博士最近对硬涂层的研究提出了测量其在基材上的结合强度的定量方法。他建议进行进一步的实验测量，以确定它们的机械性能，并与剑桥大学卡文迪什实验室的菲尔德博士的小组合作，进一步进行理论分析。本课题组对硬质涂层的应力分布、残余应力和力学性能的研究与科尔的研究非常吻合。在与Johnson博士的合作中，Keer建议使用弹塑性分析开发软薄膜和断裂力学的失效模型。他是弹性方法的主要倡导者，而约翰逊则研究材料的塑性变形。该项目有效地结合了美国和英国领先研究人员的互补专业知识和不同的科学方法。他们共同努力的结果将对微电子应力分析和设计产生重大影响，并将促进对表面工程的理解。

This award supports cooperative research in surface engineering and tribology between Dr. Leon M. Keer of Northwestern University and Drs. K.L. Johnson and J.E. Field of the University of Cambridge, United Kingdom. The objectives are to develop a methodology for measuring adhesion of hard coatings on substrates for optimum resistance against wear and delamination, and to develop a theoretical model for predicting failure of soft thin films, such as aluminum on silica. Dr. Keer's recent research on hard coatings suggests quantitative methods for measuring their bond strength on substrates. He proposes to conduct further experimental measurements to determine their mechanical properties and further his theoretical analysis in partnership with Dr. Field's group at Cambridge's Cavendish Laboratory. This group's research on stress distribution, residual stresses and mechanical properties of hard coatings fits in well with Keer's research. In collaboration with Dr. Johnson, Keer proposes to develop a failure model for soft thin film and fracture mechanics using elastic- plastic analysis. He is a leading exponent of the elastic approach while Johnson has dealt with the plastic deformation of materials. This project effectively combines the complementary expertise and different scientific approaches of leading researchers in the U.S. and United Kingdom. The results of their joint efforts will have substantial impact on microelectronic stress analysis and design and will advance understanding of surface engineering.