Picoliter Solder Droplet Dispensing for Electronics Manufacturing

用于电子制造的皮升焊滴点胶

• 批准号: 9060945
• 负责人: David Wallace
• 金额: $ 5万
• 依托单位: MicroFab Technologies Inc
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1991
• 资助国家: 美国
• 起止时间: 1991-01-01 至 1991-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9060945&HistoricalAwards=false
• 关键词: Picoliter; Solder; Droplet; Dispensing; Electronics

This research addresses solder application to printed circuit boards and other substrates with a new flexible approach that can be employed in numerous applications, directed application of molten solder droplets, using ink-jet printing technology. Ink-jet printing systems use the ejection of tiny drops of ink to produce an image. The devices produce highly reproducible and controllable drops, so that a drop may be printed at a specific location according to digitally stored image data. Several distinct applications could evolve from this research. These include: (1) A surface mount rework station for replacement of bad, or improperly assembled components that incorporates a highly accurate and automated solder droplet dispensing system; (2) An automated in-line solder process that would dispense one or more types of solder, and flux, onto electronic printed circuit board pads for bonding of high pin count, fine pitch surface mount components; and (3) Systems for special applications, such as dispensing solder droplets onto Flip Chip bonds, bumps for Tape Automated Bonding (TAB), and solder pads for flex circuit interconnects.

本研究解决焊料应用到印刷 电路板和其他基板的新的灵活的方法 其可用于许多应用中， 使用喷墨印刷的熔融焊料滴的应用 技术. 喷墨打印系统使用微小的 墨滴来产生图像。 该装置产生高 可再现和可控的液滴，使得液滴可以是可再现的和可控的。 根据数字存储的数据在特定位置打印 图像数据。 几个不同的应用程序可以从中发展 research. 这些包括：（1）表面贴装返工站， 更换不良或组装不当的部件， 结合了高度精确和自动化的焊滴 点胶系统;（2）自动在线焊接工艺， 将一种或多种类型的焊料和焊剂分配到 用于高引脚焊接的电子印刷电路板焊盘 计数，细间距表面贴装元件;和（3）系统 特殊应用，例如将焊料滴滴 倒装芯片键合、用于带式自动键合（TAB）的凸块，以及 用于柔性电路互连的焊盘。