RIA: Growth Process in Metal Thin Film and Multilayer Materials

该研究启动奖将用于研究交替金属对溅射薄膜在层生长初期的外延、应力和界面结构。生长条件和金属系统将被选择来提供界面动力学、晶格失配和生长动力学的系统变化。最初的工作将集中在Ni/Mo体系上，该体系的结晶性已经被观察到，并且显示出很大的相干应力。

This Research Initiation Award will be used to study the epitaxy, stress and interface structure which develop during the initial stages of layer growth in sputtered thin films of alternating metal pairs. Growth conditions and metal systems will be chosen to provide systematic variation in interface dynamics, lattice misfit, and growth kinetics. Initial work will concentrate on the Ni/Mo system for which sudden onset of crystallinity has been observed and which shows large coherency stresses.