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High Order Crystal Plane Selectivity in Silicon Anisotropic Wet Etching

High Order Crystal Plane Selectivity in Silicon Anisotropic Wet Etching
硅各向异性湿法刻蚀中的高阶晶面选择性
批准号:
9121862
负责人:
Peter Hesketh
金额:
$6.89万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1992
资助国家:
美国
项目状态:
已结题
起止时间:
1992-07-15 至 1993-12-31

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英文摘要
This grant supports research to gain a detailed understanding of the influence of chemical composition on the higher order plane selectivity in silicon anisotropic etching. A polished single crystal silicon sphere, 0.25 inches in diameter is chosen for the study because it provides a systematic tool to measure the plane selectivity in the various etches. Two critical questions will be addressed: the role of the cation in aqueous solutions, and the role of alcohol and other additives to the anisotropy of the etching. The visualization of three dimensional micromachined structures will assist in the design of complex microstructures.
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    2012
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    1019623
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  • 项目类别:
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