RIA: Micromechanical Study of Inelasticity in Brittle and Amorphous Materials

RIA：脆性和非晶材料非弹性的微观力学研究

• 批准号: 9309006
• 负责人: Horacio Espinosa
• 金额: $ 10万
• 依托单位: Purdue Research Foundation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-07-15 至 1996-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9309006&HistoricalAwards=false
• 关键词: RIA; Micromechanical; Study; Inelasticity; Brittle

9309006 Espinosa The purpose of this Research Initiation Award is to develop a constitutive model for brittle amorphous materials, such as ceramics and glass, for dynamic loading. In particular, pressure- shear experiments on glass thin films, in which high shear stresses, high strain rates and high pressure are imposed, offer ideal conditions for the derivation and validation of a constitutive model describing these amorphous materials. Such a model will be incorporated in micromechanical simulations of alumina polycrystals under the conditions of plate impact experiments. The postulated model is expected to predict such phenomena as damage-induced anisotrophy and shear localization. Model validation will be accomplished by comparison of simulated and interferometrically measured velocity histories in normal impact and pressure-shear experiments conducted on alumina samples.

9309006 Espinosa本研究启动奖的目的是开发脆性非晶材料的本构模型，如陶瓷和玻璃，用于动态加载。特别是在玻璃薄膜上的压力-剪切实验，其中施加高剪切应力，高应变率和高压，为推导和验证描述这些非晶材料的本构模型提供了理想的条件。该模型将应用于氧化铝多晶在平板冲击实验条件下的微观力学模拟。假设的模型有望预测损伤引起的各向异性和剪切局部化等现象。模型验证将通过在氧化铝样品上进行的正常冲击和压力剪切实验中模拟和干涉测量速度历史的比较来完成。