AMPP: Interfacial Processing and Adhesion of Titanium, Nitride, Diamondlike and Diamond Films on Metallic and Polymer Substrates

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9311343 Narayan Diamond, diamondlike and titanium nitrade films have extremely desirable chemical, electrical and mechanical properties for a variety of applications ranging from corrosion and erosion resistant coatings to electronic packaging of microelectronic devices. However, many of these applications are limited by poor adhesion of these films with metal and polymer substrates. The adhesion of a film is determined primarily by internal stresses in the film, thermal and lattice mismatch, and most importantly by interfacial bonding. Techniques are required to deposit these films, and methods based upon selective laser and ion beam irradiation of interfacial regions to improve adhesion between polymer, diamond and diamond like films and the substrate. The proposed research addresses interfacial processing and adhesion phenomena in the following systems of technological importance: diamondlike, titanium nitrade and diamond films on copper, tungston, titanium, titanium nitride, and polymer substrates. The adhesion of the polymer to the metal substrate can be improved through the silane adhesion promoters, but the adhesion of metal to the polymer substate must rely on interfacial processing. For polymer substrates, a very thin buffer layer of titanium will be used to improve adhesion between diamondlike and polymer substrates. The affinity between C (diamond) and the underlying substrates varies from zero for copper to a very high degree for titanium and tungston. The proposed research emphasizes: a) interfacial processing to improve adhesion; b) interface characterization, properties of thin films and adhesion measurement, and c) modeling to evaluate interfacial stresses and strains and toughness and to understand the adhesion and interfacial bonding mechanisms. The structure and chemical composition of the interfaces will be studied as a function of laser, ion beam, and substrate parameters. Modeling of stresses and strains within the film and t he interfaces will be carried out and the results correlated with adhesion measurements of these films.