Structural and Dynamical Aspects of Electrodeposition

9407009 Abruna这个研究项目，由分析和表面化学计划的支持，是针对发展的金属上的金属欠电位沉积过程的理解。 的表面形态和潜在的界面物种的分布变化的影响将使用动态电化学方法，X射线散射探针，如EXAFS和X射线反射率，和超高真空电子光谱方法的组合进行探测。 将检查在铂电极上沉积银和铜的生长模式，并表征吸附层的结构对金属沉积过程的影响。 这些信息对于理解电镀和薄膜生长至关重要。 详细的机理的电化学沉积薄金属膜在金属基板上是本研究项目的重点。 一个独特的X射线和电化学方法的组合将被用来提供深入了解沉积过程中的表面形态和电极-溶液界面结构的影响。 这些信息对于理解电镀和腐蚀抑制等重要的技术工艺非常有用。

9407009 Abruna This research project, supported by the Analytical and Surface Chemistry Program, is directed at developing an understanding of the process of underpotential deposition of metals on metals. The effects of surface morphology and potential dependent distributional changes of interfacial species will be probed using a combination of dynamic electrochemical methods, X-ray scattering probes such as EXAFS and X-ray reflectivity, and UHV electron spectroscopic methods. Growth modes in the deposition of silver and copper on platinum electrodes will be examined, and the effect of the structure of the adsorbed layer on the metal deposition process will be characterized. This information is crucial to the understanding of electroplating and thin film growth. %%% The detailed mechanism of the electrochemical deposition of thin metal films on metal substrates is the focus of this research project. A unique combination of X-ray and electrochemical methods will be used to provide insights into the effect of surface morphology and electrode-solution interfacial structure on the deposition process. This information is useful for understanding technologically important processes such as electroplating and corrosion inhibition.