Surface Structure Effects on the Electrodeposition of Metal Monolayers

这项研究项目得到分析和表面化学计划的支持，重点是了解金属在单晶和故意阶梯状金属表面上的欠电位沉积过程。阿布鲁纳教授和他在康奈尔大学的学生将使用动态电化学方法和X射线散射探针(如EXAFS和X射线表面衍射)相结合的方法来研究这些过程。将考察在铂电极上电沉积的银和铜的实时生长，并表征卤化物和拟卤化物对吸附层结构的影响。这些信息对于理解电镀和薄膜生长的科学和技术至关重要。研究在金属衬底上电化学沉积金属薄膜的过程是本研究项目的重点。当界面结构在沉积过程中形成时，将使用X射线和电化学方法来表征它们。这些信息有助于理解重要的技术过程，如电镀和缓蚀。

This research project, supported by the Analytical and Surface Chemistry Program, focuses on the development of an understanding of the process of underpotential deposition of metals on single crystal and deliberately stepped metal surfaces. Professor Abruna and his students at Cornell University will use a combination of dynamic electrochemical methods and X-ray scattering probes such as EXAFS and X-ray surface diffraction to study these processes. Real-time growth of silver and copper electrodeposited on platinum electrodes will be examined, and the effect on the structure of the adsorbed layer by halides and pseudo-halides will be characterized. This information is crucial to the understanding the science and technology of electroplating and thin film growth. Studies of the processes involved in the electrochemical deposition of thin metal films on metal substrates is the focus of this research project. X-ray and electrochemical methods will be used to characterize the interfacial structures as they are formed during the deposition process. This information is useful for understanding technologically important processes such as electroplating and corrosion inhibition.