Surface Structure Effects on the Electrodeposition of Metal Monolayers

该研究项目由分析和表面化学计划支持，重点是发展对单晶和故意阶梯金属表面上金属欠电位沉积过程的理解。 康奈尔大学的Abruna教授和他的学生将使用动态电化学方法和X射线散射探针（如EXAFS和X射线表面衍射）的组合来研究这些过程。 实时生长的银和铜电沉积在铂电极上将被检查，和吸附层的结构上的卤化物和拟卤化物的影响将被表征。 这些信息对于理解电镀和薄膜生长的科学和技术至关重要。 本研究的重点是在金属基底上电化学沉积金属薄膜的过程。 X射线和电化学方法将被用来表征界面结构，因为它们是在沉积过程中形成的。 这些信息对于理解电镀和腐蚀抑制等重要的技术工艺非常有用。

This research project, supported by the Analytical and Surface Chemistry Program, focuses on the development of an understanding of the process of underpotential deposition of metals on single crystal and deliberately stepped metal surfaces. Professor Abruna and his students at Cornell University will use a combination of dynamic electrochemical methods and X-ray scattering probes such as EXAFS and X-ray surface diffraction to study these processes. Real-time growth of silver and copper electrodeposited on platinum electrodes will be examined, and the effect on the structure of the adsorbed layer by halides and pseudo-halides will be characterized. This information is crucial to the understanding the science and technology of electroplating and thin film growth. Studies of the processes involved in the electrochemical deposition of thin metal films on metal substrates is the focus of this research project. X-ray and electrochemical methods will be used to characterize the interfacial structures as they are formed during the deposition process. This information is useful for understanding technologically important processes such as electroplating and corrosion inhibition.