Thermal Probing of Novel Devices, Nanostructures and Interfaces

点击翻译按钮获取中文摘要

ABSTRACT Majumdar 9625812 Fundamental development of scanning thermal microscopy and application of the technique to microscale heat transport in a variety of electronic devices and interfaces is proposed. The goal is to obtain a spatial resolution of 1-10 nm and a temporal resolution of 10 ns in temperature measurement. Thermal probing of self-assembled conducting polymers and polymeric light-emitting devices will be attemped. In addition, temperature measurements of vertical cavity surface emitting lasers and interfaces of related quantum structures are planned. The scanning thermal microscope will also be applied to reliability studies of solid-solid interfaces, such as diamond on silicon.