Workshop to Assess Needs for Manufacturing of Electronic Systems in the 21st Century; College Park, Maryland, November 3-4, 1997

评估 21 世纪电子系统制造需求研讨会；

• 批准号: 9712493
• 负责人: Marjorieann Natishan
• 金额: $ 3万
• 依托单位: University of Maryland, College Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-09-15 至 1998-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9712493&HistoricalAwards=false
• 关键词: Workshop; Assess; Needs; Manufacturing; Electronic

Worldwide electronic product revenues were $791 billion in 1995 and are forecast to reach $1.2 trillion by the year 2000. A number of technological breakthroughs must take place in order to sustain the rapid increase in the functionality of electronic systems, while maintaining their reliable operation and reducing size and cost. Manufacturing of electronic systems is a hierarchical series of processes which can be grouped into semiconductor chip manufacturing, electronic package assembly, and board and system assembly. Although the chip-level manufacturing challenges are being adequately addressed, the electronic package-level and board-level manufacturing remain relatively unexplored. This workshop is for assessing the research needs in electronics manufacturing in the twenty-first century. It will focus on identifying research needs in the development of innovative manufacturing processes; the design of next-generation; precision electromechanical systems; and, the development of virtual manufacturing tools for package and board level manufacturing. The workshop brings together experts from academia, industry and government to discuss future research needs in electronics manufacturing and to identify the electronics manufacturing barriers for the next decade that can be addressed by universities in collaboration with industry and government laboratories. The communications between the workshop participants are also helpful in building partnerships and minimizing duplicative efforts.

1995年，全世界电子产品收入为7 910亿美元，预计到2000年将达到1.2万亿美元。 必须实现若干技术突破，以维持电子系统功能的迅速增加，同时保持其可靠的运行并缩小规模和降低成本。 电子系统的制造是一系列分层的过程，可以分为半导体芯片制造，电子封装组装，电路板和系统组装。 虽然芯片级制造的挑战正在得到充分解决，但电子封装级和板级制造仍然相对未被探索。 本次研讨会旨在评估21世纪电子制造的研究需求。 它将侧重于确定创新制造工艺开发的研究需求;下一代设计;精密机电系统;以及开发用于封装和板级制造的虚拟制造工具。 该研讨会汇集了来自学术界、工业界和政府的专家，讨论电子制造业未来的研究需求，并确定未来十年电子制造业的障碍，这些障碍可以由大学与工业界和政府实验室合作解决。 讲习班参与者之间的交流也有助于建立伙伴关系和尽量减少重复工作。