I/UCRC: Modeling Thermal and Electro-Thermal Behavior Integrated Circuit Devices

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ABSTRACT EEC-9727260 RINGO This Research Opportunity Award (ROA) funds a two year project for a researcher from Gonzaga University (RUI/PUI) to work with the University of Washington research site of the Industry/University Cooperative Research Center for Design of Analog/Digital Integrated Circuits located at Washington State University. The project is entitled, "Modeling Thermal and Electro-thermal Behavior Integrated Circuit Devices." The study will address numerically solving the heat transfer problem for a "generic" integrated circuit investigating the effects of the geometry, material properties, and boundary/initial conditions on the temperature response.