I/UCRC: Modeling Thermal and Electro-Thermal Behavior Integrated Circuit Devices

I/UCRC：模拟集成电路器件的热和电热行为

• 批准号: 9727260
• 负责人: John Ringo
• 金额: $ 5万
• 依托单位: Washington State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-10-01 至 2000-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9727260&HistoricalAwards=false
• 关键词: UCRC; Modeling; Thermal; Electro; Behavior

ABSTRACT EEC-9727260 RINGO This Research Opportunity Award (ROA) funds a two year project for a researcher from Gonzaga University (RUI/PUI) to work with the University of Washington research site of the Industry/University Cooperative Research Center for Design of Analog/Digital Integrated Circuits located at Washington State University. The project is entitled, "Modeling Thermal and Electro-thermal Behavior Integrated Circuit Devices." The study will address numerically solving the heat transfer problem for a "generic" integrated circuit investigating the effects of the geometry, material properties, and boundary/initial conditions on the temperature response.

摘要EEC-9727260 RINGO 该研究机会奖（罗阿）资助一个为期两年的项目，为研究人员从贡扎加大学（RUI/PUI）与华盛顿大学的研究网站的工业/大学合作研究中心的模拟/数字集成电路设计位于华盛顿州立大学。 该项目名为“集成电路器件的热行为和电热行为建模”。" 该研究将解决数值求解热传递问题的“通用”集成电路的几何形状，材料特性和边界/初始条件对温度响应的影响进行调查。