I/UCRC for Design of Analog and Digital Integrated Systems: Micromachined Devices for High Temperature; High Voltage and High Performance...

用于模拟和数字集成系统设计的 I/UCRC：高温微机械设备；

• 批准号: 9708324
• 负责人: John Ringo
• 金额: $ 30万
• 依托单位: Washington State University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-10-01 至 2001-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9708324&HistoricalAwards=false
• 关键词: UCRC; Design; Analog; Digital; Integrated

ABSTRACT EEC-9708324 Ringo The performance of submicron CMOS components like transistors, resistors and capacitors are usually limited by the parasitic substrate elements. Past processing micromachining techniques can be employed to physically remove the cause of some of these parasites. This three-year continuing award will study the development of micromachining techniques to enhance the performance of mixed-signal circuits in a submicron CMOS technology. During the first two years, a set of primitive devices will be developed using an advanced micromachining process to be performed at the Washington Technology Center. The devices will be characterized to determine design rules and device models suitable for mixed-signal circuit simulation. In the second and third year, primitive circuit blocks will be built to determine reliability and characterize the improvement in the circuit operation. Research results will include the design rules and the specification necessary for the two past processing micromachining techniques developed to eliminate parasitic substrate elements.

摘要EEC-9708324 Ringo 晶体管、电阻和电容等亚微米CMOS器件的性能通常受到寄生衬底元件的限制。 过去的加工微机械加工技术可以用来物理地去除这些寄生虫中的一些的原因。 这个为期三年的连续奖项将研究微加工技术的发展，以提高亚微米CMOS技术中混合信号电路的性能。 在头两年，一套原始的设备将开发使用先进的微加工工艺将在华盛顿技术中心进行。 这些器件将被表征，以确定适合混合信号电路仿真的设计规则和器件模型。 在第二年和第三年，将建立原始电路模块，以确定可靠性和表征电路操作的改进。 研究结果将包括设计规则和规范必要的两个过去的处理微加工技术开发，以消除寄生衬底元件。