Compact Modeling of Integrated Microsystems
集成微系统的紧凑建模
基本信息
- 批准号:9820430
- 负责人:
- 金额:$ 16.83万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:1999
- 资助国家:美国
- 起止时间:1999-09-01 至 2002-08-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
RingoEEC-9820444This project is funded as a part of the EEC initiative on Research Centers - Small Firms Collaborative R&D. The cooperating partners are the Center for the Design of Analog-Digital Integrated Circuits (CDADIC) at Washington State University, and Analogy, Inc., a small firm located in Beaverton, OR. The work will draw upon compact device modeling carried out at CDADIC that deals with micromachined structures mainly applicable to pressure and inertial sensors. The study to be conducted under the present award will extend this concept to more generic integrated microsystems which will involve more than just electrical-mechanical coupling, and will provide a structured basis through which new public domain device models can be readily developed and incorporated into microsystem design. The work will involve close collaboration between the Center and Analogy, Inc., which is the leading developer of multi-domain, mixed-mode simulation software. The primary product, the Saber simulator, which is now a standard for automotive and aerospace system simulation, is ideally suited for treating the multiple and interconnected physical domains which arise in microsystems. The development of of simulation tools and methods for integrated microsystem design will encourage standardization, validation, and model accuracy performance measures to emerge which will support the growing field of integrated sensors, transducers, micro-electro-mechanical systems, and microanalytical systems.
RingoEEC-9820444该项目作为EEC研究中心-小公司合作研发倡议的一部分获得资助。 合作伙伴是华盛顿州立大学的模拟数字集成电路设计中心(CDADIC)和Analogy,Inc.,位于俄勒冈州比弗顿的一家小公司。 这项工作将借鉴紧凑的设备建模进行了CDADIC处理微机械结构主要适用于压力和惯性传感器。 根据本合同进行的研究将把这一概念扩展到更通用的集成微系统,这将不仅仅涉及机电耦合,并将提供一个结构化的基础,通过这个基础,新的公共领域设备模型可以很容易地开发和纳入微系统设计。 这项工作将涉及该中心和类比公司之间的密切合作,该公司是多领域、混合模式仿真软件的领先开发商。 主要产品Saber仿真器现在是汽车和航空航天系统仿真的标准,非常适合处理微系统中出现的多个相互关联的物理域。 用于集成微系统设计的仿真工具和方法的发展将鼓励标准化、验证和模型精度性能措施的出现,这将支持集成传感器、换能器、微机电系统和微分析系统的不断增长的领域。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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John Ringo其他文献
John Ringo的其他文献
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{{ truncateString('John Ringo', 18)}}的其他基金
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$ 16.83万 - 项目类别:
Standard Grant
Center for Design of Analog-Digital Integrated Circuits - NSF I/UCRC Phase III
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Continuing Grant
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