MRI: Acquisition of Instrumentation for a Thin Film Characterization Facility

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Abstract Babu Funds are awarded to acquire an atomic force microscope capable of handling samples as large as 150 mm in diameter silicon wafers, a stand-alone nanoindentor, a multiple wavelength spectroscopic ellipsomenter, and a sputter deposition system to enhance the existing thin film characterization laboratory. These instruments will be used to produce metallic films to be planarized and to confirm the relationships suggested by preliminary experiments between some of the mechanical properties (hardness, elastic modulus) of these films and those of the abrasive powders in the slurry. In situ measurements will be made of hardness and elastic modulus during polishing. Complete wafer scale mapping of the evolution of the surface morphology and defect structures during polishing and cleaning to determine within-wafer-non-uniformity.