U.S.-Japan Cooperative Science: Flatness Metrology of Large Wafers with Nanometer Accuracy

美日合作科学：纳米级精度的大晶圆平面度测量

• 批准号: 9910063
• 负责人: Peisen Huang
• 金额: $ 2.93万
• 依托单位: SUNY at Stony Brook
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-06-01 至 2004-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9910063&HistoricalAwards=false
• 关键词: U.S.; Japan; Cooperative; Science; Flatness

9910063HuangThis award supports a three year collaborative research project between Professor Peisen Huang of the State University of New York (SUNY), Stony Brook and Professor Wei Gao of Tohoku University in Japan. The researchers will be undertaking a study of the flatness metrology of large wafers with nanometer accuracy. The continuous drive toward smaller features and larger wafer sizes is making the requirements on wafer flatness increasingly stringent. This demand cannot be met by simply extending the currently existing technologies. A paradigm shift is necessary and new concepts need to be developed. This research is aimed at developing a completely new method, namely absolute flatness metrology, for next generation wafer and device manufacturing. With this method, the flatness measurement results are free from errors caused by the scanning motion and method, the flatness measurement results are free from errors caused by the scanning motion and are thus expected to be significantly more accurate compared to those achievable by the traditional methods. The project brings together the efforts of two laboratories that have complementary expertise and research capabilities. The successful use of this method will eventually eliminate the need for periodical calibration of the metrology system with a wafer master, which reduces system maintenance costs. The impact of this research is not limited to the semiconductor industry. The same technology can also be applied to the metrology of liquid crystal panels, advanced optical mirrors such as x-ray synchrotron mirrors, hard disk substrates, etc. to significantly improve their measurement accuracy. This research advances international human resources through the participation of graduate students. Through the exchange of ideas and technology, this project will broaden our base of basic knowledge and promote international understanding and cooperation. The researchers plan to publish results of the research at technical meetings and on their web site (http://www.precision.eng.sunysb.edu).

9910063黄此奖项支持斯托尼布鲁克纽约州立大学的黄培森教授和日本东北大学的高伟教授之间为期三年的合作研究项目。 研究人员将进行一项纳米精度的大型晶圆平整度计量研究。 对更小特征和更大晶片尺寸的持续驱动使得对晶片平坦度的要求越来越严格。 这一需求不能通过简单地扩展现有技术来满足。 必须进行范式转变，需要发展新的概念。 本研究旨在为下一代晶圆和器件制造开发一种全新的方法，即绝对平面度测量。 利用该方法，平坦度测量结果不受由扫描运动和方法引起的误差的影响，平坦度测量结果不受由扫描运动引起的误差的影响，并且因此与通过传统方法可实现的那些相比，期望平坦度测量结果显著更准确。 该项目汇集了两个具有互补专业知识和研究能力的实验室的努力。这种方法的成功使用将最终消除对具有晶片母版的计量系统的周期性校准的需要，这降低了系统维护成本。 这项研究的影响不仅限于半导体行业。 同样的技术也可以应用于液晶面板、先进光学镜如X射线同步加速器镜、硬盘基板等的计量，显著提高其测量精度。 本研究通过研究生的参与促进国际人力资源。 通过交流思想和技术，该项目将扩大我们的基础知识，促进国际理解与合作。 研究人员计划在技术会议上和他们的网站（http：//www.example.com）上公布研究结果。www.precision.eng.sunysb.edu