Microscopic Process and Macroscopic Behavior of Material: Modeling, Simulation, and Analysis

尊敬的彭博士，随函附上我的建议摘要的普通文件，按要求的格式。如果您认为需要进一步修改，请让我知道。向您致以最诚挚的问候，Bo Li--------------------------------------------------------------------------------Proposal号码：dms-0072958。首席研究员：李波，大学。马里兰州的大学公园。提案标题：材料的微观过程和宏观行为：建模、模拟和分析建议摘要这个项目涉及材料的各种微观过程和宏观行为的建模、模拟和分析，这些过程和宏观行为通常涉及相变、多组分和多尺度以及移动的界面。它们包括半导体薄膜的外延生长，弹性应力固体的微观结构演变，以及马氏体微结构的宏观性质。建议人将首先继续和扩展他在参与DARPA/NSF VIP项目期间开始的工作，以开发和改进薄膜外延生长的连续介质模型。特别是，他将仔细研究边缘扩散和扭结对流以及晶体不对称和各向异性对薄膜形态和生长标度规律的影响。然后，他将开发将有限元方法和多重网格算法结合到水平集公式中的混合数值技术，以模拟应力微结构的三维演化。他最后将扩展他以前的研究，进一步研究复杂马氏体微结构，重点是外加应力对其形成、演化和稳定性的影响。设计像本项目所研究的创新、智能和高质量的材料对现代技术的进步至关重要。这种设计的成功很大程度上需要对潜在的物理过程和材料行为的基本原理和基本机制有深刻的理解。因此，系统地发展合理的科学概念和新颖的研究方法来实现这一理解是本研究的目标。这种新技术的实现可能会为实验者提供关于可控物理数据的详细信息，使开发新的和改进的材料成为可能，这些材料适用于从通信到航空航天再到医学的许多现代技术和工业。另一方面，该项目突出了其科学完整性的本质，将自然地促进和促进涉及材料科学、物理、应用数学和高性能computing.--------------------------------------------------------------------------------的跨学科研究

Dear Dr. Pang, Attached is the plain file of an abstract of my proposal in the requestedformat. Please let me know if you think that further revision is needed. Best regards,Bo Li--------------------------------------------------------------------------------Proposal number: DMS-0072958. Principal investigator: Bo Li, Univ. of Maryland, College Park. Title of proposal: Microscopic Process and Macroscopic Behavior of Material: Modeling, Simulation, and AnalysisProposal AbstractThis project concerns the modeling, simulation, and analysis of a varietyof microscopic processes and macroscopic behaviors of materials that incommon involve phase transitions, multiple components and multiple scales,and moving interfaces. They include the epitaxial growth of semiconductorthin films, microstructural evolution of elastically stressed solids, andmacroscopic properties of martensitic microstructures. The proposer willfirst continue and extend his work initiated during his participation ina DARPA/NSF VIP project to develop and improve continuum models for theepitaxial growth of thin films. In particular, he will carefully examine theeffect of edge diffusion and kink convection as well as that of crystallineasymmetry and anisotropy to the thin film morphology and growth scaling laws.He will then develop hybrid numerical techniques that incorporate finiteelement methods and multigrid algorithms into level set formulations tosimulate the three-dimensional evolution of stressed microstructures. Hewill finally expand his previous research to further investigate complexmartensitic microstructures with an emphasis on the effect of applied stressto their formation, evolution, and stability.The design of innovative, intelligent, and high quality materials such asthose to be studied in this project is essential to the advance of moderntechnologies. The success in such design demands greatly a deep understandingof the fundamental principles and basic mechanisms of the underlying physicalprocesses and material behaviors. It is therefore the goal of this researchto systematically develop rational scientific concepts and novel researchtechniques to accomplish such an understanding. The fulfillment of such agoal will potentially provide experimentalists with detailed information oncontrollable physical data, making possible the development of new and improvedmaterials for applications in many modern technologies and industrials rangingfrom communication to aerospace to medicine. Highlighted by its nature ofscientific integrity, on the other hand, this project will naturally fosterand promote an interdisciplinary research that involves materials science,physics, applied mathematics, and high-performance computing.--------------------------------------------------------------------------------