Next-Generation Re-Configurable Wiresaw for Wafer Slicing and On-Line Real-Time Metrology

用于晶圆切片和在线实时计量的下一代可重新配置线锯

• 批准号: 0085021
• 负责人: Imin Kao
• 金额: $ 21.59万
• 依托单位: SUNY at Stony Brook
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-09-01 至 2005-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0085021&HistoricalAwards=false
• 关键词: Next; Generation; Re; Configurable; Wiresaw

This grant provides funding to develop the theoretical modeling as well as experimental research of the wiresaw technology. Research issues and the implementation of the next-generation re-configurable wiresaw integrated with on-line and real-time metrology, such as the real-time monitoring of wire wear and wire web management, will be investigated. Innovative modeling integrating the "rolling-indenting" mechanism, elasto-hydrodynamics, fracture mechanics, plasticity, vibration, and stiffness control will facilitate the integrated modeling of the wiresaw manufacturing process. Such sound theoretical methodology is particularly important for the production of large wafers to avoid typical trial-and-error approaches at the expense of quality and consistency. The research objectives include: (1) investigation of both theoretical and practical issues of the novel agile wiresaw, with integrated monitoring and metrology that can be adapted to slice different materials, sizes, configuration, and other characteristics; (2) development of in-situ, real-time sensors for monitoring of wire wear and on-line wire web management; (3) research of the next-generation shadow moire measurement of the whole wafer surface using the phase shifting technique to render high precision and resolution; and (4) design and application of smart MEMS transducers for the wiresaw machine. The research also features collaboration between academic institution with industrial partners to strengthen the relevance of this research and application in industry. This collaborative research will make it possible to establish a superior technology for the next-generation wiresaw.If successful, the results of this research will enable us to further the technology of wiresaw and to facilitate the advancement of semiconductor technology by providing high-quality and low-cost substrates in the fabrication of microelectronics, MEMS, and microsystems. The wiresaw research results and applications of smart MEMS transducers can be utilized for the development of the next-generation, re-configurable, and smart wiresaw for wafer production; as well as optical metrology, such as shadow moire technique with phase shifting, to enhance the capability of both in-situ and post-process measurements and controls of wiresaw manufacturing process parameters and topology of wafer surfaces. In addition, the breakthrough in fundamental research and technology advancement will feature a very promising enabling technology in the manufacturing of not only large diameter silicon wafers but also silicon carbide, lithium niobate, III-V and II-VI semiconductors, ceramic, and composite materials.

这笔赠款为发展线锯技术的理论建模和实验研究提供了资金。将研究与在线和实时测量相结合的下一代可重构线锯的研究问题和实现，如线材磨损的实时监测和线网管理。集成了滚压机构、弹流体力学、断裂力学、塑性、振动和刚度控制的创新建模将有助于线锯制造过程的集成建模。这种合理的理论方法对于大晶圆的生产尤其重要，以避免以牺牲质量和一致性为代价的典型的反复试验方法。研究目标包括：(1)研究新型灵活的线锯的理论和实践问题，该线锯具有集成的监测和测量，可以适应不同的材料、尺寸、结构和其他特性；(2)开发用于线切割磨损在线监测和在线丝网管理的现场、实时传感器；(3)研究利用相移技术实现对整个晶片表面的阴影云纹测量，以获得高精度和分辨率；以及(4)用于线锯的智能MEMS传感器的设计和应用。这项研究还具有学术机构与产业界合作的特点，以加强这项研究的相关性和在工业中的应用。这项合作研究将使我们有可能为下一代线切割建立一种优越的技术。如果成功，这项研究的结果将使我们能够进一步推进线切割技术，并通过在微电子、MEMS和微系统制造中提供高质量和低成本的衬底来促进半导体技术的进步。智能MEMS换能器的线锯研究成果和应用可用于开发用于晶片生产的下一代、可重新配置的智能线锯；以及光学计量，如相移阴影云纹技术，以增强对线锯制造工艺参数和晶片表面拓扑的在线和后处理测量和控制能力。此外，基础研究和技术进步的突破不仅将使大直径硅片的制造充满希望，而且还将使碳化硅、铌酸锂、III-V和II-VI半导体、陶瓷和复合材料的制造成为可能。