Self-Biased Y-Junction Circulator

0140177 Vittoria提出了一个双重研究计划，目的是生产第一代自偏置铁氧体环行器器件。在第一个研究计划中，他开发了制备复合铁氧体/介电材料的技术，该材料由介电浆料填充材料和定向六角铁氧体颗粒组成。在研究计划的第二阶段，他将利用复合材料的特殊性能设计和测试1至20 GHz的循环装置。他预计，自偏置循环器的性能表现类似于循环器使用尖晶石和石榴石铁氧体的频率带宽的操作，插入损耗和隔离。鉴于传统的环行器器件的特征在于所谓的“圆盘”设计，他的设计将利用众所周知的厚膜玻璃丝网印刷技术将环行器器件集成到半导体/电介质基板中。此外，这里提出的自偏置六角铁氧体环行器将消除永磁体，永磁体在大多数情况下在微波电路板中占据相当大的空间。环行器尺寸的减小转化为制造成本的降低和整个微波电路板的性能效率的提高。该研究计划包括制备复合材料的六角铁氧体和玻璃上的介电浆料，取向铁氧体复合材料的表征，带状线/微带环行器的制造，环行器的测试和建模的微波和静态性能的复合材料。

0140177VittoriaThe proposes a two-fold research plan for the purpose of producing the first generation of self-biased ferrite circulator devices. In the first research plan he develops techniques to prepare composite ferrite/dielectric materials consisting of dielectric paste filling material and oriented hexaferrite particles. In the second phase of the research plan, he will utilize the special properties of the composites to design and test circulation devices from 1 to 20 GHz. He anticipates that the performance of the self-biased circulators to behave similarly to circulators using spinel and garnet ferrites in terms of frequency bandwidth of operation, insertion loss and isolation. Whereas the traditional circulator devices is characterized by the so-called "puck" design, his design will integrate the circulator devices into a semiconductor/dielectric substrate utilizing the well known thick film glass on screen print technolagies. In addition, the self-biased hexaferrite circulators proposed here will do away with permanent magnets which in most cases occupy considerable space in a microwave circuit board. Reduction in circulator size translates into reduction of fabrication costs and increased efficiency in the performance of the overall microwave circuit board. The research program comprises of preparation of composites of hexaferrites and dielectric paste on glass, characterization of the oriented ferrite composite materials, fabrication of stripline/microstrip circulators, testing of the circulators and modeling of the microwave and static properties of the composite materials.