Integral Embedded Capacitor Component from Ultra-High Dielectric Constant Polymer-Conductive Filler Nano-Composite

集成无源器件被认为是当前分立无源器件的潜在替代品，在系统成本、尺寸、功能和可靠性方面具有优势。对于嵌入式电容器应用，聚合物-陶瓷纳米复合材料先前已被研究为高介电常数（K）材料。然而，在有机基材中使用聚合物-陶瓷复合材料存在一些技术障碍，例如，本发明人发现了一种基于聚合物-导电填料复合物的新型介电材料。初步结果表明，有效的介电常数高达2000以上，几乎相同的净聚合物基体的粘附力。为了将这种超高介电常数材料成功应用于下一代先进电子封装的集成电容器应用中，本项目将对以下问题进行基础研究：超高介电常数聚合物-导电填料复合材料配方优化：将继续努力优化配方，以实现潜在的更高材料性能。集成电容器组件建模：这可以帮助设计和过程中的整体电容器组件的关键材料和工艺参数提供定量的估计。使用开发的超高K聚合物导电填料复合材料的整体电容器组件的可加工性：原型的整体电容器将从液体或薄膜复合材料。刚性和柔性基板都将用于电容器的开发。采用建议工艺制造的一体式电容器的可靠性性能：通过850 ℃ 185%RH老化、温度、湿度和偏压（THB）老化、液-液热冲击（LLTC）和空气-空气热循环（AATC）等条件下的电性能（如介电常数和粘附强度等）的稳定性/退化进行监测。所提出的研究的预期结果将丰富对基于超高K电介质材料的集成电容器元件的基本理解，这对于实现下一代微电子封装中的集成电容器应用至关重要。

Integral passives are considered to potentially provide alternatives to current discrete passive components with benefits on system cost, size, functionality and reliability. For embedded capacitor applications, polymer-ceramic nano-composite has been previously investigated as high dielectric constant (K) materials. However, there are some technical barriers to the use of polymer-ceramic composite in organic substrate, e.g., limited dielectric constant value (150) achieved and poor adhesion towards the substrates.The proposer has discovered a novel dielectric material, which is based on polymer-conductive filler composite. The preliminary results have shown an effective dielectric constant as high as over 2000, and nearly the same adhesion as the neat polymer matrix. In order to successfully apply such ultra-high K material to integral capacitor application in next-generation advanced electronic packaging, the proposed project will perform fundamental studies on the following issues:Ultra-high K polymer-conductive filler composite formulation optimization: Continued efforts will be devoted to optimize the formulation for potentially even higher material performance.Modeling of integral capacitor component: This could aid the design and process of integral capacitor components by providing quantitative estimates of the critical material and process parameters.Processability of integral capacitor component using the developed ultra-high K polymer-conductive filler composite: Prototyping of integral capacitor will be constructed from liquid or film composite material. Both rigid and flexible substrates will be used for capacitor development.Reliability performance of the integral capacitors fabricated from the proposed processes:stability/degradation of electrical properties such as dielectric constant as well as adhesion strength, etc. will be monitored against 850C185%RH aging, temperature, humidity and bias (THB) aging, liquid-liquid thermal shock (LLTC), and air-air thermal cycle (AATC), etc.Expected results from the proposed research will enrich the fundamental understanding about the integral capacitor component based on ultra-high K dielectric materials, which will be essential for the realization of integral capacitor application in next-generation micro-electronic packaging.