SBIR Phase I: Encapsulation Technology for Organic Light Emitting Displays

这个小企业创新研究（SBIR）第一阶段项目旨在开发有机发光二极管（OLED）显示器的封装层。低成本的薄膜封装被广泛认为是充分发挥OLED技术潜力的关键技术。在低温和无湿环境下沉积的透明薄膜封装层需要用于轻量化和低成本的OLED显示器和微显示器。该项目专注于新颖的原子层沉积（ALD）技术，该技术专为在低于100℃的工艺温度下具有成本效益的OLED器件封装而设计。传统的ALD技术在此温度范围内速度缓慢，并且化学物质的使用效率低下。有效的ALD工艺和设备的结合避免了这些问题。目的包括封装OLED器件的性能和可靠性评估，并进行相应的成本分析。由于OLED器件的薄膜封装技术尚未成功开发，因此如果项目成功，将标志着便携式显示器件市场的突破。OLED市场预计将在未来五年内增长到每年超过16亿美元的收入，主要归功于微显示应用。预计未来几年，OLED将在500亿美元的平板显示器（FPD）市场中发挥更大的作用。目前OLED器件加工设备中缺失的一块，真空沉积封装技术将为工艺设备供应商提供实质性的竞争优势。因此，这可能标志着美国在FPD市场重新获得大量市场份额的切入点。

This Small Business Innovation Research (SBIR) Phase I project aims to develop encapsulation layers for organic light emitting diode (OLED) displays. Cost-effective thin film encapsulation is widely recognized as a crucial key technology needed to capitalize on the full potential of OLED technology. Transparent thin film encapsulation layers deposited at low temperatures and moisture-free ambient are needed for lightweight and low cost OLED displays and microdisplays. This project is focused on novel atomic layer deposition (ALD) techniques that are especially designed for cost-effective encapsulation of OLED devices at process temperatures below 100 C. Traditional ALD techniques are impractically slow at this temperature range and make inefficient usage of chemicals. These problems are circumvented by a combination of efficient ALD process and equipment. Objectives include evaluation of encapsulated OLED device performance and reliability, with corresponding cost analysis. A successful project can mark a breakthrough in the market of portable display devices since adequate thin film encapsulation technologies for OLED devices have not been developed successfully so far. The OLED market is projected to grow to over $1.6 billion in revenues annually, attributed mostly to microdisplay applications, within the next five years. It isexpected that OLED will play a bigger role in the $50 billion Flat Panel Display (FPD) market in subsequent years. Currently the missing piece in OLED device processing equipment, vacuum-deposition encapsulation technology will provide a substantial competitive edge to process equipment vendors. It can thus signify an entry point for the U.S. to regain a substantial market share in the FPD market.