ITR: Ultra High Density Computer Interconnect

已经确定了一种能够实现超高密度电子封装连接的技术：芯片到封装;封装到插座;以及板到板（连接器）。 这种方法被命名为“AC耦合互连”，有可能大幅增加电子封装所有层的连接功能密度，并允许引脚数继续扩展。 这项技术将允许微处理器芯片拥有数千个引脚，而不是今天的数百个。它将允许连接器和插座也支持数千个引脚。 这将导致更快的计算机，网络系统等。中心论点是，这一努力取决于认识到，数字信号的直流分量不携带任何信息，并且非接触式交流连接可以比直流连接更密集和更简单。 非接触结构的阵列比接触结构的阵列固有地更致密、更柔顺并且更机械鲁棒。 通过仅在需要DC电流传输的地方施加直接接触，这种方法将允许实现非常高密度的互连，并减轻在其他高密度互连技术中遇到的顺应性和返工问题。 AC连接可以是电感的、电容的或两者的组合。

A technique has been identified that will enable ultra high-density electronic packaging connectivity: chip to package; package to socket; and board to board (connector). Named "AC coupled interconnect", this approach has the potential to enable a massive increase in the functional density of connections across all layers of electronic packaging and permit pin counts to continue scaling. This technique will allow microprocessor chips to have thousands of pins, instead of the hundreds enabled today. It will allow connectors and sockets to also support thousands of pins. This will lead to faster computers, networking systems, etc.The central thesis is this effort hinges on the recognition that the DC component of a digital signal carries no information, and that non-contacting AC connections can be built a lot denser and simpler than DC connections. An array of non-contacting structures is inherently denser, more compliant and more mechanically robust than an array of contacting structures. By imposing direct contacts only where DC current transfers are needed, this approach will allow very high density interconnects to be realized and alleviate the compliance and rework problems encountered in other high density interconnect technologies. The AC connections can be inductive, capacitive, or a combination of the two.