CAREER: Nanoscale Thermal Processing with a Heated Atomic Force Microscope Cantilever Tip

摘要：原子力显微镜（AFM）自1986年发明以来，已成为纳米科学和纳米技术应用最广泛的仪器。用于热机械数据存储的AFM悬臂梁具有曲率半径接近20nm的尖端和集成加热。当加热的悬臂尖端与基材接触时，只有尖端与基材之间的接触区域被加热。由于接触直径小至1nm，加热的AFM悬臂尖端与衬底之间的接触面积是有史以来最小的受控热源。因此，加热后的AFM悬臂尖端是研究纳米尺度下热传递和相变基本原理的绝佳工具，而纳米尺度与宏观尺度有很大不同。本研究计划开发加热AFM悬臂尖端作为纳米尺度表征温度依赖的物理和化学转变的科学仪器。该教育计划包括开设一门新的热流体微纳米器件设计研究生课程。参与这项研究的研究生也将接触到广泛的技术和文化经验，包括与国家实验室和行业以及国际合作者的合作。该奖项是由化学和运输系统分部的热传输和热处理项目支持的。

AbstractProposal Number: CTS-0238888Principal Investigator: William P. KingAffiliation: Georgia Institute of TechnologyProposal Title: CAREER: Nanoscale thermal processing with a heated atomic force microscope cantilever tipSince its invention in 1986, the atomic force microscope (AFM) has become the most widely used instrument for nanoscience and nanotechnology. AFM cantilevers used in thermomechanical data storage are fabricated with a tip having a radius of curvature near 20 nm and integrated heating. As the heated cantilever tip is brought into contact with a substrate, only the area of contact between the tip and the substrate is heated. With a diameter of contact as small as 1 nm, the contact area between a heated AFM cantilever tip and a substrate is the smallest controlled heating source ever produced. Thus, the heated AFM cantilever tip is an excellent tool for studying the fundamentals of heat transport and phase change at the nanometer scale, which can be substantially different compared to macroscopic scales. This research plan develops the heated AFM cantilever tip as a scientific instrument for nanometer-scale characterization of temperature-dependant physical and chemical transitions. The educational plan includes the development of a new graduate course in the design of thermal and fluid micro and nano devices. Graduate students involved in this research will also be exposed to a broad set of technical and cultural experiences, including collaborations with national laboratories and industry and with international collaborators.The award is supported by the Thermal Transport and Thermal Processing Program of the Chemical and Transport Systems Division.