NER: Silicon Insert Molded Plastics (SIMP)

NER：硅嵌件模压塑料 (SIMP)

• 批准号: 0303738
• 负责人: Alexander Slocum
• 金额: --
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-07-15 至 2005-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0303738&HistoricalAwards=false
• 关键词: NER; Silicon; Insert; Molded; Plastics

The objective of this research is to develop a process for injection molding polymer parts with sub-micron three-dimensional features, such as angled planes, using a process we call Silicon Insert Molded Plastics (SIMP). It is hypothesized that silicon inserts can be manufactured using microfabrication techniques allowing for tolerances, smoothness, and dimensions at a nanoscale level. In particular, advantage would be taken of silicon's ability to be selectively etched for low cost with KOH to obtain nanometer smooth 111 planes at an inclination angle of 54.7 degrees from the vertical (for a common 100 wafer), There are a host of precision products from surgical tools to fiber optic couplers that can be created with the 111 planes, and in particular, the availability of planes and edges with nanometer precision can revolutionize the way small precision parts are designed.Research into the SIMP process will progress in four areas. The first area is the design and fabrication of the silicon inserts. While microfabrication processes are becoming standardized, many concerns must be addressed for each new part, especially for features such as cooling passages or KOH etched features combined with DRIE features. The second area of research must account for the integration of the silicon inserts into a metal mold carrier that is then inserted into the molding machine. For example, thermal effects on the silicon inserts are a major concern for processing of the polymer, mold lifetime and accuracy issues. The third research area investigates the material processing aspects of nanoscale features in polymers. Specifically, the issues to address are the determination of the limits of moldable features and the discovery of techniques to improve the processability of the polymers. The final research area encompasses the design of parts to allow for easier molding of any nanoscale features. Undergraduate and graduate students will be working closely with our industrial partners -- Bayer Corp. (Polymers Division), Schick, and Teradyne Connection Systems - to help develop the SIMP process thus ensuring rapid transfer of the technology to industry.

本研究的目的是开发一种用于注射成型具有亚微米三维特征的聚合物部件的工艺，例如倾斜平面，使用我们称为硅插入成型塑料（SIMP）的工艺。 据推测，硅插入物可以使用微加工技术制造，允许公差，光滑度和尺寸在纳米级水平。 特别是，利用硅的低成本选择性腐蚀的能力，以获得与垂直方向成54.7度倾斜角的纳米级光滑111平面（对于常见的100晶片），存在可以用111平面创建的从手术工具到光纤耦合器的许多精密产品，并且特别地，具有纳米精度的平面和边缘的可用性可以彻底改变小型精密零件的设计方式。2对SIMP工艺的研究将在四个方面取得进展。 第一个领域是硅嵌件的设计和制造。 虽然微制造工艺正在变得标准化，但每个新部件都必须解决许多问题，特别是对于诸如冷却通道或KOH蚀刻特征与DRIE特征相结合的特征。 第二个研究领域必须考虑将硅嵌件集成到金属模具载体中，然后将其插入成型机中。 例如，硅嵌件上的热效应是聚合物加工、模具寿命和精度问题的主要关注点。 第三个研究领域调查的材料加工方面的纳米级功能的聚合物。 具体而言，要解决的问题是确定可模塑特征的极限和发现改善聚合物加工性能的技术。 最后的研究领域包括部件的设计，以允许更容易地成型任何纳米级特征。 本科生和研究生将与我们的工业合作伙伴-拜耳公司（聚合物部门），Schick和Teradyne连接系统-密切合作，以帮助开发SIMP工艺，从而确保技术快速转移到行业。