A Stress Wave-Induced Direct Pattern Transfer Procedure for Efficient Manufacturing ICs and MEMS Devices

在此之前，人们开发了一种激光散裂实验来测量薄膜的粘附性。在实验中，Nd:YAG激光脉冲在衬底背面转换成压应力波，衬底前表面沉积有测试膜。这种应力波从薄膜的自由表面反射成张力波，并撬开了界面。该技术的一个扩展，也是本研究的主题，是利用激光产生的应力波分离沉积在硅或玻璃或任何母基板上的单个线、正方形和圆形薄膜片，并在靠近分离结构的目标基板上捕获分离的特征或“乐高”。与已经成熟的对准技术相结合，可以有效地开发MEMS结构和集成电路（ic）几何形状。任何材料的结构和子结构都可以在任何工程基板上创建，包括柔性塑料和胶带。除了了解单个特征的分离和重新连接机制的基础知识外，我们还将构建用于典型MEMS和IC器件的三个基本构建块-梁桥，膜隔膜和柔性基板上的IC电路。这些结构将涉及各种各样的材料，如金属、聚合物和陶瓷。电路和系统的小型化继续推动着一场技术革命，它带来了2000亿美元的集成电路产业，从根本上改变了世界经济和我们社会的生活和工作方式。例如，由集成电路行业创造的许多产品使极其有用和流行的电子系统（例如，个人计算机，计算机网络，仪器仪表，手机，复杂的电子设备等）的廉价生产成为可能。通过帮助在柔性塑料上构建微系统来扩大产品基础，并允许在同一设备上开发涉及异质材料（金属，聚合物，陶瓷，半导体，现在甚至是生物细胞）集成的新微系统，拟议的研究将通过集成集成电路和MEMS来降低生产成本，扩大其当前的应用基础。并根据生物医学系统和其他先进传感器的发展需要解决复杂的异质材料集成问题。为促进研究成果向业界传播，我们每年举办为期一天的工业研讨会，介绍研究成果，并由业界人士介绍技术方向和需求。本科生和研究生将有机会与行业代表互动，并在本次研讨会上展示他们的成果。

Previously, a laser spallation experiment was developed to measure adhesion of thin films. In the experiment, a Nd:YAG laser pulse is converted into a compressive stress wave on the backside of the substrate that has a test film deposited on its front surface. This stress wave reflects into a tensile wave from the film's free surface and pries off the interface. An extension of this technique, which is the subject of the proposed work, is to separate individual lines, squares, and circular thin film patches deposited on a Si or a glass or for that matter on any mother substrate using the laser-generated stress-waves, and catch the separated features or "legos" on a target substrate kept in close vicinity of the separating structures. Combination with already matured alignment technology can allow development of MEMS structures and Integrated-Circuits (ICs) geometries in an efficient way. Structures and substructures of any material can be created on any engineering substrate, including flexible plastics and tapes. Besides understanding the basics of separation and reattachment mechanisms for individual features, we will construct three basic building blocks used in a typical MEMS and IC device-a beam bridge, a membrane diaphragm, and an IC circuit on a flexible substrate. These constructs will involve materials as diverse as metals, polymers, and ceramics. The miniaturization of electrical circuits and systems continues to fuel a technological revolution responsible for a $200B IC industry, which has fundamentally changed the world economy and the way our society lives and works. For example, many products created by the IC industry enable the inexpensive production of extremely useful and popular electronic systems (e.g., personal computers, computer networks, instrumentation, cell phones, sophisticated electronic appliances etc). By allowing major expansion of the product base by helping construction of microsystems on flexible plastics, and allowing development of newer microsystems that involve heterogeneous material (metals, polymers, ceramics, semiconductors, and now even biological cells) integration on the same device, the proposed research will lead to low cost of production by integration of ICs and MEMS, expansion of their current application base, and solve complicated heterogeneous materials integration issues as needed in the development of BioMEMS and other advanced sensors. To facilitate the dissemination of the research results to industry, a 1-day annual Industrial Colloquium will be held with presentations of this research and presentations from industry participants on technology directions and needs. Undergraduate and graduate students will have the opportunity to interact with industry representatives and present their results at this colloquium.