Microcircuit and MEMS Package Survivability during Shock and Accidental Drop

微电路和 MEMS 封装在冲击和意外跌落期间的耐受性

• 批准号: 0400696
• 负责人: Pradeep Lall
• 金额: $ 18万
• 依托单位: Auburn University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-09-01 至 2008-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0400696&HistoricalAwards=false
• 关键词: Microcircuit; MEMS; Package; Survivability; during

The objective of this research is to develop fundamental understanding of failure mechanics of microcircuit packaging and MEMS packaging at high strain rates. The objective will be achieved through three major thrusts including, characterization of initiation and progression of failure mechanisms in integrated circuits during drop impact, study of materials and interfaces under high strain rates encountered during drop, and development of models for prediction of failure. Materials and material interfaces of microcircuit and MEMs packages will be studied including, SnPb and Pb-free solders, copper metallization and pads, printed circuit laminates, semiconductors, and molding compounds. Test structures will be developed to study material constitutive behavior, and damage threshold relationships. Strain rates in the range of 101 to 102 sec-1 will be used for characterization. Computational models will be developed for prediction of microcircuit survivability in shock and accidental drop environments. Intellectual merit of the proposed research is the fundamental structured approach to design damage tolerant electronics which will be available for system designers, based on predictability in design performance of microcircuits in shock and accidental drop environments. An advanced design framework will reduce dependence on experimental methods for evaluation of system performance and help reduce cost and time. The proposed research will be a significant advancement over the state-of-the-art. The broader impact and outreach activities of this project will target course development, focused sessions at conferences, special issues in electronic packaging journals, and introduction of elementary school children and undergraduates to portable electronics through lab tours and in-class presentations.

本研究的目的是发展在高应变率下的微电路封装和MEMS封装的失效机理的基本理解。 这一目标将通过三个主要方面来实现，包括：在跌落冲击过程中集成电路故障机制的启动和进展的表征，在跌落过程中遇到的高应变率下的材料和界面的研究，以及故障预测模型的开发。 将研究微电路和MEMS封装的材料和材料界面，包括SnPb和无铅焊料、铜金属化和焊盘、印刷电路板、半导体和模塑料。 将开发试验结构以研究材料本构行为和损伤阈值关系。 将使用101 - 102 sec-1范围内的应变速率进行表征。 计算模型将被开发用于预测在冲击和意外跌落环境中的微电路的生存能力。 拟议研究的智力价值是设计抗损伤电子器件的基本结构化方法，该方法将可供系统设计人员使用，其基于冲击和意外跌落环境中微电路设计性能的可预测性。 先进的设计框架将减少对系统性能评估实验方法的依赖，并有助于降低成本和时间。 拟议的研究将是一个显着的进步，在国家的最先进的。更广泛的影响和推广活动，这个项目将针对课程开发，重点会议，在电子封装期刊的特刊，并介绍小学生和大学生的便携式电子通过实验室图尔斯参观和课堂演示。