Survivability Envelopes for Lead-Free Interconnects in Fine-Pitch Electronics under Combined Extreme Environments of Shock, Vibration and Temperature
冲击、振动和温度综合极端环境下细间距电子无铅互连的生存能力范围
基本信息
- 批准号:1127913
- 负责人:
- 金额:$ 15万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2011
- 资助国家:美国
- 起止时间:2011-08-01 至 2014-07-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This proposal seeks funding for the Center for Advanced Vehicle and Extreme Environment Electronics (CAVE) located at Auburn University. Funding Requests for Fundamental Research are authorized by an NSF approved solicitation, NSF 10-601. The solicitation invites I/UCRCs to submit proposals for support of industry-defined fundamental research. The objective of proposed research is to develop fundamental understanding of failure mechanics of extreme environment electronics under overlapping stresses of high temperature, cyclic thermal stresses, shock and vibration. The proposed research will target the development of methodologies for prediction of damage initiation and progression for multi-mode competing failure locations in and the vicinity of board-level interconnects. Fundamental understanding of the high-strain rate material and interface behavior will be developed under sequential and simultaneous exposure of stresses. Damage equivalence relationships and survivability envelopes will be developed using pre-cursors. It is envisioned that the proposed research will result in development of key enabling methodologies which are scalable to a wide array of extreme environment applications. Examples include automotive and avionic systems which are subjected to simultaneous temperature and transient dynamic loads. Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. The broader impact and outreach activities will include, (a) Initiation of undergraduate students, women and under-represented minorities in research. (b) Partner with the Womens Leadership Institute at Auburn University (c) Organization of topical-session at the ASME Congress (IMECE) (d) Incorporation of research results in extreme environment applications in cooperation with leading manufacturers which are industrial members of the NSF Center for Advanced Vehicle Electronics (CAVE3). (f) Introduction of K-12 school children to electronics through lab tours and in-class presentations.
该提案为位于奥本大学的先进车辆和极端环境电子中心(CAVE)寻求资金。基础研究的资助申请由 NSF 批准的征集 NSF 10-601 授权。此次征集邀请 I/UCRC 提交支持行业定义的基础研究的提案。 拟议研究的目的是加深对高温、循环热应力、冲击和振动重叠应力下极端环境电子器件失效力学的基本了解。拟议的研究将致力于开发用于预测板级互连内及其附近多模式竞争故障位置的损坏起始和进展的方法。对高应变率材料和界面行为的基本理解将在连续和同时暴露的应力下得到发展。将使用前体来开发损伤等价关系和生存能力范围。预计所提出的研究将导致关键支持方法的开发,这些方法可扩展到广泛的极端环境应用。例子包括同时承受温度和瞬态动态负载的汽车和航空电子系统。汽车应用中传感器和控制装置的使用增加,导致人们非常重视直接安装在发动机和变速箱上的电子设备的部署。更广泛的影响和外展活动将包括: (a) 启动本科生、妇女和代表性不足的少数群体参与研究。 (b) 与奥本大学女性领导力研究所合作 (c) 在 ASME 大会 (IMECE) 上组织专题会议 (d) 与作为 NSF 先进车辆电子中心 (CAVE3) 工业成员的领先制造商合作,将极端环境应用的研究成果纳入其中。 (f) 通过实验室参观和课堂演示向 K-12 学童介绍电子产品。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Pradeep Lall其他文献
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads
- DOI:
10.1016/j.microrel.2009.03.024 - 发表时间:
2009-08-01 - 期刊:
- 影响因子:
- 作者:
Pradeep Lall;Madhura Hande;Chandan Bhat;Vikrant More;Rahul Vaidya - 通讯作者:
Rahul Vaidya
Real-time Deformation Correction in Additively Printed Flexible Antenna Arrays
加法印刷柔性天线阵列中的实时变形校正
- DOI:
- 发表时间:
2024 - 期刊:
- 影响因子:0
- 作者:
Sreeni Poolakkal;Abdullah Islam;Shrestha Bansal;Arpit Rao;Ted Dabrowski;Kalsi Kwan;Amit Mishra;Quiyan Xu;Erfan Ghaderi;Pradeep Lall;Sudip Shekhar;Julio Navarro;Shenqiang Ren;John Williams;Subhanshu Gupta - 通讯作者:
Subhanshu Gupta
Classification of multiple failure modes in package-on-package (PoP) assemblies using feature vectors for progression of accrued damage
使用特征向量对层叠封装 (PoP) 组件中的多种故障模式进行分类,以了解累积损坏的进展情况
- DOI:
10.1109/itherm.2012.6231472 - 发表时间:
2012 - 期刊:
- 影响因子:0
- 作者:
Pradeep Lall;Prashant Gupta;Kai Goebel - 通讯作者:
Kai Goebel
Pradeep Lall的其他文献
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{{ truncateString('Pradeep Lall', 18)}}的其他基金
Phase-III: Center for Advanced Vehicle and Extreme Environment Electronics
三期:先进车辆与极端环境电子中心
- 批准号:
0968381 - 财政年份:2010
- 资助金额:
$ 15万 - 项目类别:
Standard Grant
SGER: Leading Indicators of Failure for Implantable Biological-Systems
SGER:可植入生物系统失败的先行指标
- 批准号:
0740012 - 财政年份:2007
- 资助金额:
$ 15万 - 项目类别:
Standard Grant
Microcircuit and MEMS Package Survivability during Shock and Accidental Drop
微电路和 MEMS 封装在冲击和意外跌落期间的耐受性
- 批准号:
0400696 - 财政年份:2004
- 资助金额:
$ 15万 - 项目类别:
Continuing Grant
Center for Advanced Vehicle Electronics - Five Year Renewal
先进汽车电子中心 - 五年续展
- 批准号:
0434909 - 财政年份:2004
- 资助金额:
$ 15万 - 项目类别:
Continuing Grant
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