CAREER: Geometry and Morphology Effects in Colloidal Adhesion

本计画将发展第一原理方法，以描述复杂的几何形状与形态对微米级胶体与基材间黏附力的影响。这在美国半导体制造业中非常重要。 描述颗粒粘附的传统方法依赖于Derjaguin-Landau-Verwey-Overbeek（DLVO）理论或使用粘附功结合Derjaguin-Muller-Toporov（DMT），Johnson-Kendall-Roberts（JKR）或Maugis-Dugdale（MD）模型进行胶体变形的方法。 这些方法只适用于理想体系，该方法将修正传统的货车范德华力（vdW）表达式，以描述水溶液中的粘附。它将解释基底和胶体的复杂几何形状和形态，还将包括胶体和基底的变形和粗糙度。将包括半导体社区感兴趣的几何和形态复杂的胶体衬底系统的描述。 将使用原子力显微镜（AFM）进行接触粘附力的测量。 胶体是很好的模型材料，也是集成电路工艺中常见的污染物（SiO2和Al 2 O3）。衬底是集成电路加工的重要衬底。在半导体工业中，所提出的方法可以立即应用于蚀刻后处理和化学机械抛光后处理期间的晶片清洁方案。在生物医学行业，它可用于改善植入物灭菌过程。

This project will develop a first principle method for describing the effects of complex geometry and morphology on the adhesion of micron-scale colloids to substrates. This is of importance in the U.S. semiconductor manufacturing industry. Traditional approaches to describing particle adhesion rely on Derjaguin-Landau-Verwey-Overbeek (DLVO) theory or on approaches using the work of adhesion in conjunction with the Derjaguin-Muller-Toporov (DMT), Johnson-Kendall-Roberts (JKR), or Maugis-Dugdale (MD) models for colloid deformation. These approaches are only applicable for idealized systems.The proposed approach will modify traditional van der Waals (vdW) force expressions to describe the adhesion in aqueous solution. It will account for complex geometry and morphology of the substrates and colloids and also will include the deformation and roughness of the colloids and substrates. Descriptions of geometrically and morphologically-complex colloid-substrate systems of interest to the semiconductor community will be included. Measurement of the contact adhesion force will be performed with an atomic force microscope (AFM). The colloids are either good model materials or common contaminants in integrated circuit processing (SiO 2 , and Al 2 O 3 ). The substrates are important substrates for integrated circuit processing.In the semiconductor industry, the proposed approach could find immediate application in wafer cleaning protocols during post-etch processing and post-chemical-mechanical-polishing processing. In the biomedical industry, it could be used to improve implant sterilization processes.