CAREER: Geometry and Morphology Effects in Colloidal Adhesion

职业：胶体粘附中的几何和形态效应

• 批准号: 0401632
• 负责人: Stephen Beaudoin
• 金额: --
• 依托单位: Purdue University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-08-23 至 2005-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0401632&HistoricalAwards=false
• 关键词: CAREER; Geometry; Morphology; Effects; Colloidal

This project will develop a first principle method for describing the effects of complex geometry and morphology on the adhesion of micron-scale colloids to substrates. This is of importance in the U.S. semiconductor manufacturing industry. Traditional approaches to describing particle adhesion rely on Derjaguin-Landau-Verwey-Overbeek (DLVO) theory or on approaches using the work of adhesion in conjunction with the Derjaguin-Muller-Toporov (DMT), Johnson-Kendall-Roberts (JKR), or Maugis-Dugdale (MD) models for colloid deformation. These approaches are only applicable for idealized systems.The proposed approach will modify traditional van der Waals (vdW) force expressions to describe the adhesion in aqueous solution. It will account for complex geometry and morphology of the substrates and colloids and also will include the deformation and roughness of the colloids and substrates. Descriptions of geometrically and morphologically-complex colloid-substrate systems of interest to the semiconductor community will be included. Measurement of the contact adhesion force will be performed with an atomic force microscope (AFM). The colloids are either good model materials or common contaminants in integrated circuit processing (SiO 2 , and Al 2 O 3 ). The substrates are important substrates for integrated circuit processing.In the semiconductor industry, the proposed approach could find immediate application in wafer cleaning protocols during post-etch processing and post-chemical-mechanical-polishing processing. In the biomedical industry, it could be used to improve implant sterilization processes.

该项目将开发一种第一性原理方法，用于描述复杂几何形状和形态对微米尺度胶体粘附在基材上的影响。这在美国半导体制造业中非常重要。描述颗粒粘附的传统方法依赖于derjaguin - landau - vervey - overbeek （DLVO）理论，或者使用粘附工作与Derjaguin-Muller-Toporov （DMT）、Johnson-Kendall-Roberts （JKR）或Maugis-Dugdale （MD）胶体变形模型相结合的方法。这些方法只适用于理想化的系统。该方法将改进传统的范德华力表达式来描述水溶液中的粘附性。它将考虑基质和胶体的复杂几何和形态，也将包括胶体和基质的变形和粗糙度。描述几何和形态复杂的胶体-衬底系统感兴趣的半导体社区将包括在内。接触粘附力的测量将用原子力显微镜（AFM）进行。胶体要么是良好的模型材料，要么是集成电路加工中的常见污染物（sio2和al2o3）。衬底是集成电路加工的重要衬底。在半导体工业中，所提出的方法可以立即应用于后蚀刻加工和后化学-机械-抛光加工过程中的晶圆清洁协议。在生物医学行业，它可以用来改善植入物的灭菌过程。