GOALI - Particle Adhesion in Semiconductor Wafer Cleaning

CBET-0829086 Beaudoin这项研究是对微电子界感兴趣的微米和纳米尺度颗粒与纳米结构晶片的粘附力进行的理论和实验研究。目前，微电子工业还没有用于清洁未来晶片的可制造技术。特别地，晶片上的感兴趣的图案太脆弱而不能经受现有的清洁方法。新的清洗技术的发展需要了解的污染物的粘附力，但在晶片上的图案的长度尺度正在迅速接近的长度尺度的基本力，控制颗粒的粘附。这项工作将测量和模拟这种粘附力。所提出的工作的智力价值在于新的理论和实验方法被用来分类的粘附微米和纳米尺度的颗粒粗糙的纳米图案或纳米层状表面。有限的，图案化的表面上的货车的范德华力和表面之间的静电粘附力的影响的新的理论描述将开发和实验验证。在研究中已经做出了规定，以测量和模拟毛细作用力，如果它们出现的话。将进行胶体探针显微镜检查，以允许直接测量基底和颗粒之间的粘附力。使用聚焦离子束/扫描电子显微镜（FIB/SEM）或扫描透射电子显微镜/能量过滤透射电子显微镜（STEM/EFTEM）以纳米级精度创建颗粒几何形状和形态的3D图将允许创建颗粒表面的详细模型。这些将用于预测观察到的粘附力的力模型。这类模型将是第一个。这项工作的更广泛影响是以几种方式阐述的。首先，这项工作的技术成果对微电子行业具有深远的重要性，因为该行业目前还没有清洁未来晶片和光掩模的可制造方法。颗粒粘附对于制药工业也是至关重要的，其中颗粒流动和颗粒混合是必要的过程，并且在国土安全事务中，其中爆炸物、生物制剂或放射性制剂的纳米和微米颗粒的采样和感测是必要的。拟议的工作也将是当地一所小学外联工作的一部分，每年将有120多名二年级学生和6名教师参加。学生和教师将以小组形式前往普渡大学，并将使用AFM制作树叶、草地、CD、DVD、指甲、头发和皮肤的地形图。他们将采取他们收集的图像，并使用它们来加强他们在课堂上学习的内容，使用由Beaudoin和教学人员共同开发的课程。 在这项工作中的行业合作伙伴，FSI国际（FSI），将提供晶圆，颗粒沉积能力，晶圆清洗能力，并评估晶圆清洗效果的计量。Beaudoin将对FSI提供的晶圆进行颗粒粘附和建模研究，并将这些研究的结果反馈给FSI。反过来，FSI将使用这些结果来优化其基于低温气溶胶的晶圆清洁器的操作，并将记录Beaudoin粘附模型的准确性。FSI还将在每年夏天接待Beaudoin的学生一个月，在FSI的工业环境中进行实验。

CBET-0829086BeaudoinThis proposed research is a combined theoretical and experimental study of the adhesion of micro- and nano-scale particles to nano-structured wafers of interest to the microelectronics community. At present the microelectronics industry has no manufacturable technologies for cleaning future wafers. In particular, the patterns of interest on the wafers are too fragile to be subjected to existing cleaning approaches. The development of new cleaning technologies requires understanding of the contaminant adhesion forces, but the length scales of the patterns on the wafers are rapidly approaching the length scales of the basic forces that control the particle adhesion. This work will measure and model this adhesion. The Intellectual Merit of the proposed work lies in the new theoretical and experimental methods to be employed to categorize the adhesion of micro- and nano-scale particles to rough nano-patterned or nano-layered surfaces. New theoretical descriptions of the effects of finite, patterned surfaces on the van der Waals and electrostatic adhesion forces between the surfaces will be developed and validated experimentally. Provisions within the research have been made to measure and model capillary forces, should they arise. Colloidal probe microscopy will be performed to allow adhesion forces between the substrates and the particles to be measured directly. The use of focused ion beam/scanning electron microscopy (FIB/SEM) or scanning transmission electron microscopy/energy-filtered transmission electron microscopy (STEM/EFTEM) to create 3D maps of particle geometry and morphology with nano-scale precision will allow creation of detailed models of the particle surfaces. These will be used in force models that predict the observed adhesion. Such models will be the first of their kind. The Broader Impacts of this work are articulated in several fashions. First, the technical results of the work are of profound importance to the microelectonics industry, as the industry currently possesses no manufacturable approaches for cleaning future wafers and photomasks. Particle adhesion is also critically important to the pharmaceutical industry where particle flows and particle mixing are essential processes, and in homeland security matters, where sampling and sensing of nano- and micro-particles of explosives, biological agents, or radioactive agents is necessary. The proposed work will also be part of an outreach effort to a local elementary school that will involve over 120 second graders and 6 teachers each year. The students and teachers will travel to Purdue in small groups and will use the AFM to make topographical maps of leaves, grass, CDs, DVDs, fingernails, hair and skin. They will take the images they collect and use them to reinforce the content they are learning in the classroom using lessons jointly developed by Beaudoin and the teaching staff. The industry partner in this work, FSI International (FSI), will provide wafers, particle deposition capability, wafer cleaning capability, and metrology for evaluating wafer cleaning effectiveness. Beaudoin will perform particle adhesion and modeling studies on the wafers provided by FSI, and will feed the results of these studies back to FSI. FSI, in turn, will use these results to optimize the operation of its cryogenic aerosol-based wafer cleaner, and will document the accuracy of Beaudoin's adhesion models. FSI also will host Beaudoin's student for one month each summer to perform experiments in an industrial setting at FSI.