SST: Micromachined Sensors for the Direct Measurement of Wall Shear Stress

[0428593] mark sheplakflorida大学在佛罗里达大学进行了一项为期3年的研究和课程项目，主要研究硅微机械、浮动元件剪切应力传感器的开发和使用。具体来说，新的研究和教育重点集中在设计、制造、严格表征和使用微型浮动元件传感器上，这些传感器可以直接、定量地测量时间分辨的波动壁面剪切应力。这种测量技术对于从根本上理解并最终控制阻碍微型飞行器（MAVs）可控飞行的三维非定常分离流动现象至关重要。目前还不可能精确测量波动壁剪应力，这种能力的实现不仅抑制了MAV的发展，而且影响了从基础科学研究到生物医学应用的广泛应用范围。教育计划的重点是通过将跨学科设计和解决问题的技术纳入本科和研究生课程，为21世纪的工程学生做好准备。具体而言，建立了一个实验课程和几个课程模块，重点是培养跨学科解决问题的能力。此外，将通过政府实验室实习和远程学习社区外展为学生提供教育机会。该项目由传感器倡议NSF 04-522资助。

Abstract0428593Mark SheplakUniversity of FloridaA 3-year research and curriculum project in the development and use of silicon-micromachined, floating-element, shear-stress sensors is carried out at the University of Florida. Specifically, a new research and education thrust is focused on the design, fabrication, rigorous characterization, and use of miniature floating-element sensors that enable the direct, quantitative measurement of time-resolved, fluctuating wall shear stress. Such measurement technology is crucial to gain a fundamental understanding of and ultimately to enable the control of the three-dimensional, unsteady separated flow phenomena that prevents the controllable flight of Micro Air Vehicles (MAVs). The accurate measurement of fluctuating wall shear stress is currently not possible and the realization of this capability not only inhibits MAV development, but impacts a broad application spectrum that ranges from fundamental scientific research to biomedical applications. The focus of the education plan is to prepare students for engineering in the 21st century through the incorporation of interdisciplinary design and problem-solving techniques into both the undergraduate and graduate curriculum. Specifically, a laboratory course and several course modules that focus on the development of interdisciplinary problem-solving skills are established. In addition, educational opportunities for students will be established via government laboratory internships and distance-learning community outreach. This project is supported under the Sensors Initiative NSF 04-522.