Compact non-invasive ultrasonic flow and wind speed sensors based on micromachined ultrasonic transducers compatible with above-IC integration
Compact non-invasive ultrasonic flow and wind speed sensors based on micromachined ultrasonic transducers compatible with above-IC integration
批准号:
543712-2019
负责人:
Nabki, Frederic
金额:
$10.85万
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2020
资助国家:
加拿大
项目状态:
已结题
起止时间:
2020-01-01 至 2021-12-31
中文摘要
从历史上看,流量传感器一直是广泛的工业和医疗应用的主力。然而,它们通常相对较大,这限制了部署,或者,如果是微机械的,它们通常依赖于强制侵入性操作的热效应,这限制了兼容应用程序的数量。超声波流量传感器可以弥补后一种限制,而电容式微机械超声波换能器(CMUTs)可以使它们更紧凑,减轻了前者的限制。工业合作伙伴MEMS- vision希望开始一项研究工作,以扩展其定制的MEMS以上ic兼容制造工艺,以创建此类传感器。MEMS-Vision旨在创建最紧凑的传感系统,包括传感器和集成电路。它已经寻求Nabki教授的专业知识,他的经验跨越了微机电系统(MEMS)和集成电路的设计和制造,以协调合作的研究工作。因此,本项目旨在基于cmut创建紧凑型非侵入式超声波流量和风速传感器,不仅涉及换能器的设计和制造,还涉及驱动,偏置,信号调理和处理集成电路的设计,这些都是创建集成传感系统所需的。在这个项目的过程中,将解决有关增强工艺、集成电路、封装和集成到紧凑型传感系统中的挑战,以扩大MEMS-Vision技术的潜力。
英文摘要
Historically, flow sensors have been a workhorse in a wide range of industrial and medical applications. However, they are typically relatively large which limits deployment or, if micromachined, they often rely on thermal effects forcing invasive operation, which limits the number of compatible applications. Ultrasonic flow sensors can remedy the latter limitation, and capacitive micromachined ultrasonic transducers (CMUTs) can render them more compact, mitigating the former limitation. Industrial partner MEMS-Vision wishes to start a research effort to expand its custom MEMS above-IC compatible fabrication process to create such sensors. MEMS-Vision aims to create the most compact sensing system, including both the transducer and integrated circuits. It has sought the expertise of Prof. Nabki, whose experience spans the design and fabrication of microelectromechanical systems (MEMS) as well as integrated circuits, to orchestrate this research effort in collaboration. Accordingly, this project aims to create compact non-invasive ultrasonic flow and wind speed sensors based on CMUTs, touching not only on the design and fabrication of the transducers, but on the design of the driving, biasing, signal conditioning, and processing integrated circuits that are required to create an integrated sensing system. Challenges pertaining to the enhanced process, integrated circuits, packaging, and integration into compact sensing systems will be addressed over the course of this project to expand the potential of MEMS-Vision's technology.
The project's outcomes will go beyond enhancing MEMS-Vision's process and creating novel compact flow and wind speed sensors, as the CMUTs devised could find applications in other areas such as fingerprinting or medical imaging. The HQP will gain advanced and marketable design and manufacturing skills in a multidisciplinary setting touching both MEMS and electronics. The project will train 2 post-doctoral fellows, 2 PhDs, 2 Master's and 2 undergraduate students. It will yield advances in the fields of MEMS, sensing, interfacing ICs, and integration, which represents significant contributions to research in Canada.
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