Modeling and Synthesis of 3D Self-Assembly Processes

本研究的目的是研究自组装过程的基本原理，用于在微米到纳米尺度上大规模并行制造工程系统。新开发的模型将能够描述和预测系统设计参数之间的关系（例如，材料、几何形状、部件数量）和工艺性能参数（例如，组装时间、产量）。这些新发现的理论结果将与实验“模型系统”进行验证。该方法是一种独特的理论，计算技术的结合，与MEMS实验室实验并行开发。具体目标是开发（a）部件与部件结合相互作用的物理学计算模型，可以预测结合范围、强度和对准精度等特性;（B）设计合成工具，这反过来将导致基于工程自组装的新的或改进的制造方法;（c）新的结合机制，和（d）分析性但易于处理的大规模自我-装配过程，可以预测过程参数，如产量和预期的装配时间。第一个更广泛的影响是潜在的革命性制造业，通过引入范式转移从串行，确定性的装配自动化到大规模并行，随机自组装。第二个更广泛的影响在于本科生和少数民族学生参与这项前沿研究，这已被证明是学生后来决定成为工程师或研究人员的关键部分。PI参与华盛顿大学设立的三个项目，这些项目有助于将代表性不足的群体中积极性很高的候选人与他们的研究项目相匹配。

The objective of this research is to investigate the fundamental principles of self-assembly processes for the massively parallel manufacture of engineered systems at the micro to nano scale. The newly developed models will be able to describe and predict the relationship between system design parameters (e.g., materials, geometry, component count) and process performance parameters (e.g., assembly time, yield). These newfound theoretical results will be validated with an experimental "model system". The approach is a unique combination of theoretical, computational techniques, developed in parallel with MEMS laboratory experiments. Specific goals are the development of (a) computational models of the physics of part-to-part binding interactions that can predict characteristics such as binding range, strength, and alignment accuracy; (b) design synthesis tools, which in turn will lead to new or improved manufacturing methods based on engineered self-assembly; (c) novel binding mechanisms, and (d) analytical yet tractable models of large-scale self-assembly processes that can predict process parameters such as yield and expected assembly times.The first broader impact is the potential to revolutionize manufacturing, by introducing a paradigm shift away from serial, deterministic assembly automation to massively parallel, stochastic self-assembly. The second broader impact lies in the involvement of undergraduate and minority students in this cutting edge research, which has been shown to be a crucial part of a student's later decision to become an engineer or researcher. The PIs participate in three programs set up by the University of Washington, which facilitate the matching of highly motivated candidates from underrepresented groups to their research projects.