NSF-Germany Materials Collaboration: High Temperature Materials for Microelectromechanical Systems

NSF-德国材料合作：用于微机电系统的高温材料

• 批准号: 0502669
• 负责人: Kevin Hemker
• 金额: $ 21万
• 依托单位: Johns Hopkins University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-08-01 至 2009-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0502669&HistoricalAwards=false
• 关键词: NSF; Germany; Materials; Collaboration; Temperature

Technical: This international multidisciplinary research team from Forschungszentrum Karlsruhe (FZK, Germany) and Johns Hopkins University (JHU, USA) proposes to undertake a collaborative DFG-NSF program to develop novel electrodeposited LIGA (LIGA is an acronym from the German words for lithography, electroplating, and molding) materials for high temperature MEMS applications. The technological motivation for this collaboration is derived from the need to expand the reliability and functionality of current MEMS materials. The overarching scientific theme involves judicious control and optimization of processing parameters in a way that will tailor the underlying microstructure and attendant mechanical properties of novel LIGA MEMS materials. Current LIGA structures are severely limited by their dismal high temperature properties, and the focus of the proposed research will be on the development of new electrodeposited MEMS: high temperature alloys, dispersion strengthened composites and Ni-base superalloys. Processing issues related to the fabrication of micron- sized structures will be addressed at FZK (the birthplace of LIGA), and unique characterization and elevated temperature microsample testing techniques (recently developed at JHU) will be employed to characterize the full-range of mechanical properties of these new materials. Non-Technical: To date, the majority of commercial MEMS devices have been thin film sensors manufactured using chemical and vapor deposition processes. Future MEMS applications will not be restricted to two-dimensional structures and the development of elevated temperature LIGA materials is predicted to be an enabling technology in regard to the development of next generation MEMS. Close collaboration between the two institutions, providing complementary and synergistic expertise, will be required to fulfill the scientific mission of the proposal, and integrated exchanges of graduate students and senior researcher scientists will both create the vehicle for this collaboration and provide a unique educational experience for all participants. Moreover, the proposed participation in Congressional Visit Days will introduce JHU students to the need and opportunity for young scientists to educate congressional members and staffers and in so doing promote the support of science and technology on Capital Hill.

技术：这个由Forschungszentum Karlsruhe(德国FZK)和Johns Hopkins University(JHU，美国)组成的国际多学科研究团队计划开展DFG-NSF合作项目，以开发用于高温MEMS应用的新型电沉积LIGA(LIGA是德语中光刻、电镀和模塑的首字母缩写)材料。这种合作的技术动机源于扩展现有MEMS材料的可靠性和功能的需要。最重要的科学主题包括明智地控制和优化工艺参数，以适应新型LIGA MEMS材料的潜在微结构和相应的机械性能。现有的LIGA结构由于高温性能差而受到严重限制，目前的研究重点是开发新型的电沉积MEMS：高温合金、弥散强化复合材料和镍基高温合金。将在FZK(LIGA的发源地)解决与制造微米级结构相关的工艺问题，并将采用独特的表征和高温微样品测试技术(最近在JHU开发)来表征这些新材料的各种机械性能。非技术：到目前为止，大多数商用MEMS器件都是使用化学和气相沉积工艺制造的薄膜传感器。未来的MEMS应用将不仅仅局限于二维结构，高温LIGA材料的开发有望成为下一代MEMS发展的一项使能技术。两个机构之间的密切合作，提供互补和协同的专业知识，将需要完成该提案的科学使命，研究生和高级研究人员科学家的综合交流将为这种合作创造工具，并为所有参与者提供独特的教育体验。此外，拟议中的国会访问日活动将向JHU的学生介绍年轻科学家教育国会议员和工作人员的需要和机会，并通过这样做促进国会山的科学技术支持。