Quilt Packaging: A New Paradigm for the Integration of Heterogeneous Communications Systems-in-Package [UND_FY05_009]

题目：被子封装：异构通信系统集成的新范式芯片对芯片通信是集成系统吞吐量的瓶颈。有几家公司已经开发了自己的技术来增加ic之间的信号带宽，包括IBM、Sun Microsystems和SiliconPipe。pi计划开发一种独特的互连ic方法，与工业开发的方法相比，这种方法将带来几个重要的好处。该方法是一种微加工技术，导致数百或数千个小金属结节从IC芯片的侧面伸出，允许IC连接在一起（焊接或焊接）形成一个“被子”的芯片，这样信号在IC之间以非常高的速度和可以忽略不计的功耗传输。该技术在提案中被称为被子包装（QP）。除了速度和性能的提高（预计至少达到150 GHz）之外，通过消除目前ic中使用的大多数高功率pad驱动器，可以降低系统的功耗。电路的同样减少将减少芯片的空间，从而降低集成电路的成本和提高产量。此外，由于多个qp连接的IC将驻留在一个封装中，因此IC封装的总数将减少，从而降低系统成本，减小尺寸和重量。这些属性可能对军事、太空和商业手持系统产生重要影响。被子包装的另一个重要特点是在被子中使用异质材料作为面板。这可能会为光学、射频或数字通信应用带来全新的系统级封装。此外，在被子包装出现之前不可能实现的新架构将成为可能。pi已经演示了一个简单的QP工艺，并制作了带有突出结节的模具。他们目前正在设计微波试验台，以验证预测的高频特性。该提案要求资金进一步推进该工艺，进行先进的高频测量，并展示具有四分之一微米环形振荡器的真正硅ic，该振荡器包含QP结，使信号在每个级之间的两个连接的ic之间跳转。

ABSTRACTPROPOSAL NO: 0515392 PI: Gary Bernstein INST: University of Notre Dame TITLE: Quilt Packaging: A New Paradigm for the Integration of Heterogeneous Communications Systems-in-Package Chip-to-chip communications is a bottleneck for integrated systems throughput. Several companies have developed their own technology for increasing the signal bandwidth between ICs, including IBM, Sun Microsystems, and SiliconPipe. The PIs paln to developed a unique method of interconnecting ICs that will result in several important benefits compared with those under development by industry. The approach is a micromachining technique resulting in hundreds or thousands of small metal nodules that protrude out from the sides of IC die, allowing ICs to be connected (soldered or welded) together to form a "quilt" of die, such that signals traverse between the ICs at very high speeds and with negligible power dissipation. The technique has been called Quilt Packaging (QP) in the proposal.Besides the increase in speed and performance (predicted to be at least 150 GHz), power dissipation of systems can be reduced by eliminating most of the high-power pad drivers currently in use in ICs. This same reduction in circuitry will decrease the chip real-estate, resulting in lower-cost ICs and higher yields. Additionally, since several QP-connected ICs will reside in one package, the total number of IC packages will be reduced resulting in lower system cost, smaller size, and lower weight. These attributes may have an important impact on military, space, and commercial hand-held systems. One more important feature of Quilt Packaging is the use of heterogeneous materials as panels in the quilt. This may lead to entirely new systems-in-package for optical, RF, or digital communications applications. Additionally, newarchitectures not possible prior to the advent of Quilt Packaging will be made possible. The PIs have already demonstrated a simple QP process, and have made die with protruding nodules. They are currently in the process of designing microwave test beds to demonstrate the predicted high-frequency characteristics. This proposal requests funds to make further advances in the process, perform advanced high-frequency measurements, and demonstrate real silicon ICs with quarter-micron ring oscillators that incorporate QP nodules such that the signals jump between two connected ICs between each stage.