Quilt Packaging: A New Paradigm for the Integration of Heterogeneous Communications Systems-in-Package [UND_FY05_009]

Quilt 封装：异构通信系统封装集成的新范式 [UND_FY05_009]

• 批准号: 0515392
• 负责人: Gary Bernstein
• 金额: $ 27.58万
• 依托单位: University of Notre Dame
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-07-01 至 2007-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0515392&HistoricalAwards=false
• 关键词: Quilt; Packaging; New; Paradigm; Integration

ABSTRACTPROPOSAL NO: 0515392 PI: Gary Bernstein INST: University of Notre Dame TITLE: Quilt Packaging: A New Paradigm for the Integration of Heterogeneous Communications Systems-in-Package Chip-to-chip communications is a bottleneck for integrated systems throughput. Several companies have developed their own technology for increasing the signal bandwidth between ICs, including IBM, Sun Microsystems, and SiliconPipe. The PIs paln to developed a unique method of interconnecting ICs that will result in several important benefits compared with those under development by industry. The approach is a micromachining technique resulting in hundreds or thousands of small metal nodules that protrude out from the sides of IC die, allowing ICs to be connected (soldered or welded) together to form a "quilt" of die, such that signals traverse between the ICs at very high speeds and with negligible power dissipation. The technique has been called Quilt Packaging (QP) in the proposal.Besides the increase in speed and performance (predicted to be at least 150 GHz), power dissipation of systems can be reduced by eliminating most of the high-power pad drivers currently in use in ICs. This same reduction in circuitry will decrease the chip real-estate, resulting in lower-cost ICs and higher yields. Additionally, since several QP-connected ICs will reside in one package, the total number of IC packages will be reduced resulting in lower system cost, smaller size, and lower weight. These attributes may have an important impact on military, space, and commercial hand-held systems. One more important feature of Quilt Packaging is the use of heterogeneous materials as panels in the quilt. This may lead to entirely new systems-in-package for optical, RF, or digital communications applications. Additionally, newarchitectures not possible prior to the advent of Quilt Packaging will be made possible. The PIs have already demonstrated a simple QP process, and have made die with protruding nodules. They are currently in the process of designing microwave test beds to demonstrate the predicted high-frequency characteristics. This proposal requests funds to make further advances in the process, perform advanced high-frequency measurements, and demonstrate real silicon ICs with quarter-micron ring oscillators that incorporate QP nodules such that the signals jump between two connected ICs between each stage.

摘要提案编号：0515392 PI：加里伯恩斯坦研究所：美国圣母大学标题：棉被包装：一个新的范例集成异构通信系统的封装芯片到芯片的通信是一个瓶颈，集成系统的吞吐量。 几家公司已经开发了自己的技术来增加IC之间的信号带宽，包括IBM，Sun Microsystems和SiliconPipe。 PI计划开发一种独特的集成电路互连方法，与工业界正在开发的方法相比，这种方法将带来几个重要的好处。 该方法是一种微机械加工技术，导致数百或数千个小金属结节从IC管芯的侧面突出，允许IC连接（焊接或熔接）在一起以形成管芯的“被子”，使得信号以非常高的速度在IC之间穿过，并且功耗可以忽略不计。 该技术在提案中被称为Quilt Packaging（QP）。除了提高速度和性能（预计至少为150 GHz）外，还可以通过消除目前在IC中使用的大部分高功率焊盘驱动器来降低系统的功耗。同样，电路的减少将减少芯片的面积，从而降低IC的成本和提高产量。此外，由于几个QP连接的IC将驻留在一个封装中，因此IC封装的总数将减少，从而导致更低的系统成本、更小的尺寸和更低的重量。 这些属性可能对军事、空间和商业手持系统产生重要影响。 被子包装的一个更重要的特点是使用异质材料作为被子的面板。 这可能会导致全新的系统级封装，用于光学，RF或数字通信应用。 此外，在被子包装出现之前不可能的新建筑将成为可能。 PI已经展示了一个简单的QP过程，并制作了带有突出结节的模具。 他们目前正在设计微波试验台，以证明预测的高频特性。 该提案要求提供资金，以进一步推进工艺，进行先进的高频测量，并展示具有四分之一微米环形振荡器的真实的硅IC，该环形振荡器包含QP结节，使得信号在每个阶段之间的两个连接IC之间跳跃。