TCHCS: Novel Superconnects for Ultrahigh-Performance Hybrid Communications Systems

abstractecs - 0636575 g。摘要：高性能系统的可用性不再受到设备性能的限制，而是受到先进技术成本和封装性能的限制。特别是，50至75千兆赫的无线链路已经被证明连接了基于光纤和无线网络，但由于将各种组件集成到紧凑和成本效益高的系统中的成本，这在商业上是不可用的。本文提出了一种新的接口技术，以提高高速系统的性能和降低成本。通常情况下，信号从一个IC流过导线或凸起，进入引线并进入基板或板，然后反向到另一个IC。所提出的新技术通过使用IC结构，使芯片能够边缘到边缘互连，从而在IC之间直接创建了大大改进的电路路径，从而实现最高的带宽和最低的损耗。pi称之为“被子包装”，因为由此产生的骰子马赛克让人想起缝制的布被子。这些pi将利用他们制造硅集成电路“棉被”的经验，包括化合物半导体微波和光电子电路。将演示在带宽超过100ghz的芯片之间传播的信号。MEMS结构将建立在骰子的边缘，并连接到新的传输路径，以实现非常高的频率和最小的损耗。QP互连将用于演示高性能、紧凑和廉价的光到射频无线通信链路，作为包含三个ic的演示车辆，即光电探测器、简单信号处理器和发射器。更广泛的影响-被子封装技术有可能对微波和光电子电路的混合集成产生重大影响。QP的优点包括：使用各种材料的ic异构集成，高带宽，降低功耗，降低系统成本，芯片面积更小。在提高性能的同时降低包装成本将使消费者能够接触到许多通信系统。在网络通信领域，这可能对缩小各经济阶层之间以及发展中国家和第三世界国家之间的技术差距产生重大影响。这些私人顾问还计划利用他们在大一工程课程上的教学经验，将这些概念以及信息技术发展的社会影响带给崭露头角的工程师。该项目所展示的社会效益和高科技方面将用于激励进入工程专业的学生。智力上的优点——这项工作提出了许多智力上的挑战，一旦解决，将对微波、光电、混合封装和系统开发领域做出贡献。其中包括观察ic之间信号传输的新方法，功率、带宽和成本与可靠性和工艺开发等方面的权衡。超高速片对片通信的发展可能最终导致新的系统架构充分利用。最后，必须开发新的制造技术，以使直接的芯片对芯片系统在消费市场上可行。

AbstractECS-0636575G. Bernstein, Univ. of Notre DameSummary- The availability of high-performance systems is no longer limited by device performance, but rather by the cost of advanced technologies and the packaging performance. In particular, 50-to-75 GHz wireless links have been demonstrated linking fiber-based and wireless networks, but this is not available commercially due partly to the cost of integrating the various components into compact and cost-efficient systems. Here, novel interface technology to improve the performance of high-speed systems at lower cost is presented. Typically, signals flow from one IC through a wire or bump, into a lead and onto a substrate or board and then the reverse to another IC. The proposed novel technology creates a vastly improved electrical circuit path directly between ICs through the use of IC structures that allow chips to be edge-to-edge interconnected, resulting in the highest possible bandwidth and lowest possible losses. The PIs call this "Quilt Packaging" because the resulting mosaic of dice is reminiscent of a sewn cloth quilt. The PIs will build on their experience fabricating "quilts" of silicon ICs to include compound semiconductor microwave and optoelectronic circuits. Signals propagating among chips with bandwidths in excess of 100 GHz will be demonstrated. MEMS structures will be built on the edges of dice, and connected to effect the novel transmission paths that allow very high frequencies with minimal losses.QP interconnects will be used to demonstrate high performance, compact, and inexpensive optical-to-RF wireless communication links as a demonstration vehicle comprising three ICs, namely a photodetector, simple signal processor, and transmitter. Broader Impacts- Quilt Packaging technology has the potential to make a significant impact in the hybrid integration of microwave and optoelectronics circuits. Advantages of QP include: heterogeneous integration of ICs using various materials, high bandwidth, reduced power, reduced system cost, and smaller chip area. Lowering the cost of packaging while improving performance will bring many communications systems within reach of consumers. In the area of network communications, this could have a significant impact on narrowing the technology divide between economic classes as well as developing and third-world countries. The PIs also plan to use their experience in teaching Freshman engineering classes to bring these concepts, as well as the social implications of developments in information technology, to budding engineers. The benefits to society and the aspect of high-technology demonstrated by this program will be used to excite entering engineering students.Intellectual Merit- Many intellectual challenges are presented by this work that, when solved, will form a contribution to the field of microwave, optoelectronic, and hybrid packaging and systems development. These include new ways of looking at signal transmission between ICs, tradeoffs in terms of power, bandwidth and cost versus reliability and process development, and others. The development of ultra-fast chip-to-chip communication may ultimately lead to new system architectures to take full advantage. Finally, new manufacturing techniques will have to be developed to allow direct chip-to-chip systems to be feasible in the consumer market.