TCHCS: Novel Superconnects for Ultrahigh-Performance Hybrid Communications Systems

摘要ECS-0636575 G。伯恩斯坦，圣母大学摘要-高性能系统的可用性不再受设备性能的限制，而是受先进技术的成本和包装性能的限制。 特别是，50至75 GHz的无线链路已经被证明可以连接基于光纤的网络和无线网络，但这在商业上是不可用的，部分原因是将各种组件集成到紧凑且具有成本效益的系统中的成本。在这里，新的接口技术，以提高高速系统的性能，以较低的成本。 通常，信号从一个IC通过导线或凸块流入引线并流到基板或板上，然后反向流到另一个IC。 所提出的新技术通过使用允许芯片边缘到边缘互连的IC结构直接在IC之间创建了大大改进的电路路径，从而实现了最高可能的带宽和最低可能的损耗。 PI称之为“被子包装”，因为由此产生的骰子马赛克让人想起缝制的布被子。 PI将建立在他们的经验，制造硅集成电路的“被子”，包括化合物半导体微波和光电电路。 将演示带宽超过100 GHz的芯片之间的信号传播。 MEMS结构将被构建在芯片的边缘，并连接以实现新的传输路径，允许非常高的频率和最小的损耗。QP互连将被用于演示高性能，紧凑，廉价的光到RF无线通信链路，作为一个演示车辆，包括三个集成电路，即光电探测器，简单的信号处理器和发射机。更广泛的影响-绗缝包装技术有可能对微波和光电子电路的混合集成产生重大影响。 QP的优点包括：使用各种材料的IC的异构集成、高带宽、降低的功率、降低的系统成本和更小的芯片面积。 降低包装成本，同时提高性能，将使许多通信系统在消费者的范围内。 在网络通信领域，这可能对缩小经济阶层之间以及发展中国家和第三世界国家之间的技术差距产生重大影响。 PI还计划利用他们在教授新生工程课程方面的经验，将这些概念以及信息技术发展的社会影响带给崭露头角的工程师。 该项目所展示的社会效益和高科技方面将用于激发进入工程专业的学生。智力优势-这项工作提出了许多智力挑战，一旦解决，将对微波，光电和混合封装和系统开发领域做出贡献。 这些包括看待IC之间信号传输的新方法，功率，带宽和成本与可靠性和工艺开发等方面的权衡。 超快芯片到芯片通信的发展可能最终导致新的系统架构充分利用。 最后，必须开发新的制造技术，使直接芯片到芯片系统在消费市场上可行。

AbstractECS-0636575G. Bernstein, Univ. of Notre DameSummary- The availability of high-performance systems is no longer limited by device performance, but rather by the cost of advanced technologies and the packaging performance. In particular, 50-to-75 GHz wireless links have been demonstrated linking fiber-based and wireless networks, but this is not available commercially due partly to the cost of integrating the various components into compact and cost-efficient systems. Here, novel interface technology to improve the performance of high-speed systems at lower cost is presented. Typically, signals flow from one IC through a wire or bump, into a lead and onto a substrate or board and then the reverse to another IC. The proposed novel technology creates a vastly improved electrical circuit path directly between ICs through the use of IC structures that allow chips to be edge-to-edge interconnected, resulting in the highest possible bandwidth and lowest possible losses. The PIs call this "Quilt Packaging" because the resulting mosaic of dice is reminiscent of a sewn cloth quilt. The PIs will build on their experience fabricating "quilts" of silicon ICs to include compound semiconductor microwave and optoelectronic circuits. Signals propagating among chips with bandwidths in excess of 100 GHz will be demonstrated. MEMS structures will be built on the edges of dice, and connected to effect the novel transmission paths that allow very high frequencies with minimal losses.QP interconnects will be used to demonstrate high performance, compact, and inexpensive optical-to-RF wireless communication links as a demonstration vehicle comprising three ICs, namely a photodetector, simple signal processor, and transmitter. Broader Impacts- Quilt Packaging technology has the potential to make a significant impact in the hybrid integration of microwave and optoelectronics circuits. Advantages of QP include: heterogeneous integration of ICs using various materials, high bandwidth, reduced power, reduced system cost, and smaller chip area. Lowering the cost of packaging while improving performance will bring many communications systems within reach of consumers. In the area of network communications, this could have a significant impact on narrowing the technology divide between economic classes as well as developing and third-world countries. The PIs also plan to use their experience in teaching Freshman engineering classes to bring these concepts, as well as the social implications of developments in information technology, to budding engineers. The benefits to society and the aspect of high-technology demonstrated by this program will be used to excite entering engineering students.Intellectual Merit- Many intellectual challenges are presented by this work that, when solved, will form a contribution to the field of microwave, optoelectronic, and hybrid packaging and systems development. These include new ways of looking at signal transmission between ICs, tradeoffs in terms of power, bandwidth and cost versus reliability and process development, and others. The development of ultra-fast chip-to-chip communication may ultimately lead to new system architectures to take full advantage. Finally, new manufacturing techniques will have to be developed to allow direct chip-to-chip systems to be feasible in the consumer market.