SBIR Phase II: Integration of Advanced Power Electronics through the Packaging of High Temperature Silicon-Carbide (SiC) Based Multichip Power Modules (MCPMs)

SBIR 第二阶段：通过封装基于高温碳化硅 (SiC) 的多芯片功率模块 (MCPM) 集成先进电力电子器件

• 批准号: 0522272
• 负责人: Alexander Lostetter
• 金额: --
• 依托单位: Arkansas Power Electronics International, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-08-01 至 2007-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0522272&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Integration; Advanced

This Small Business Innovation Research (SBIR) Phase II research project will develop highly miniaturized power converters by developing a functional, scaled-down hardware prototype of a high-temperature multichip power module (MCPM). To achieve this goal, the company has taken advantages of the key benefits of silicon carbide (SiC) semiconductors which include high-temperature operation, high switching frequencies, low switching losses, and high power densities. While Phase I of the project was focused upon successfully proving the feasibility of high-temperature MCPM's, Phase II will be focused on developing full prototype modules. The Phase II project will further develop high-temperature packaging techniques and investigate long term reliability issues associated with high-temperature operation. At the conclusion of Phase II, the company will deliver two high-temperature MCPM modules. The first prototype delivery will be a fully functional 4-hp 3-phase motor drive MCPM capable of 250 degrees C operation, and the second prototype will be a 30 kW 3-phase motor drive that demonstrates an order of magnitude miniaturization over modern state-of-the-art silicon based systems. Since current silicon electronics are typically limited to approximately 150 degrees C maximum temperature of operation, the high-temperature research proposed in this project has the potential to greatly enhance scientific understanding of high-temperature failure mechanisms, thermal induced electronic packaging stresses, and long-term interconnect reliability issues, in addition to technical advancement of state-of-the-art power electronics systems. The commercialization of SiC based MCPM's has the potential to find benefit in nearly every electric motor drive, power supply, or power converter conceivable. The application of such MCPM's could save electrical energy consumption worldwide, due to the improved electrical efficiency of SiC power switches alone. Furthermore, an immediate commercialization application is possible in the development of high-temperature geological petroleum exploration instrumentation and also in industrial motors. Other long term benefits would be found with application to complex weight critical power systems (such as in spacecraft), high-temperature systems (such as fuel cell electronics or electric vehicle motors), and other high efficiency power systems.

该小型企业创新研究（SBIR）第二阶段研究项目将通过开发高温多芯片功率模块（MCPM）的功能性缩小硬件原型来开发高度小型化的功率转换器。为了实现这一目标，该公司充分利用了碳化硅（SiC）半导体的关键优势，包括高温工作、高开关频率、低开关损耗和高功率密度。虽然该项目的第一阶段重点是成功证明高温MCPM的可行性，但第二阶段将重点开发完整的原型模块。第二阶段项目将进一步开发高温封装技术，并研究与高温操作相关的长期可靠性问题。在第二阶段结束时，该公司将提供两个高温MCPM模块。第一个原型交付将是一个功能齐全的4马力三相电机驱动MCPM，能够在250摄氏度的操作，第二个原型将是一个30千瓦的三相电机驱动器，展示了一个数量级的小型化超过现代最先进的硅基系统。由于目前的硅电子器件通常限于约150摄氏度的最高工作温度，本项目中提出的高温研究有可能大大提高对高温故障机制，热诱导电子封装应力和长期互连可靠性问题的科学理解，除了最先进的电力电子系统的技术进步。基于SiC的MCPM的商业化有可能在几乎所有可能的电动机驱动器、电源或功率转换器中找到益处。这种MCPM的应用可以节省全世界的电能消耗，这是由于SiC功率开关本身的电效率提高。此外，在高温地质石油勘探仪器和工业电机的开发中也可以立即商业化应用。 应用于复杂的重量关键动力系统（例如航天器）、高温系统（例如燃料电池电子设备或电动汽车电机）和其他高效动力系统还可以发现其他长期好处。