Symposium "Surface-mediated Assembly of Polymers, Colloids and Nanoparticles: From 2D to 3D"; ACS National Meeting; Washington, DC; 8/28-9/1/05

研讨会“聚合物、胶体和纳米颗粒的表面介导组装：从 2D 到 3D”；

• 批准号: 0527966
• 负责人: Svetlana Sukhishvili
• 金额: $ 0.45万
• 依托单位: Stevens Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-05-01 至 2006-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0527966&HistoricalAwards=false
• 关键词: Symposium; Surface; mediated; Assembly; Polymers

The proposal requests funding for a symposium Surface-mediated Assembly of Polymers, Colloids and Nanoparticles: From 2D to 3D which will be held in Washington, DC, on August 28 - September 1, 2005 at the 230th ACS National Meeting in association with the Division of Polymer Materials: Science and Engineering. Symposium organizers include: Paula T. Hammond, MIT, USA; Gleb Sukhorukov, MaxPlanck Institute of Colloids and Interfaces, Germany; and Svetlana Sukhishvili, Stevens Institute of Technology, USA. Intellectual merit. This symposium will address self- and directed assembly approaches to the construction of thin film heterostructures, colloidal structures, responsive ultrathin films and membranes. Major distinguishing features of the symposium include: (1) integration of theory and modeling approaches to experimental science and engineering of self-assembly; (2) representation of recent developments in surface self-assembled materials in Asia; and (3) emphasis on increased participation of young faculty,postdoctoral associates and graduate students. Broader impact. The symposium aims to bring together leading scientists from the US, Europe and Asia, both materials scientists and engineers, working in the interdisciplinary area of surface self-assembly. Encouraged participation of students will enable them to be exposed to state-of-the-art knowledge in the field and to sharpen their knowledge of the field during focused discussions with leading researchers. Through support from NSF, US graduate students will be entitled to financial compensation toward their travelexpenses.

该提案要求为将于2005年8月28日至9月1日在华盛顿举行的第230届ACS全国会议上与聚合物材料：科学与工程部联合举办的专题讨论会“聚合物、胶体和纳米颗粒的表面介导组装：从2D到3D”提供资金。 研讨会组织者包括：保拉T。哈蒙德，麻省理工学院，美国; Gleb Sukhorukov，MaxPlanck Institute of Colloids and Interfaces，德国;和Svetlana Sukhishvili，Stevens Institute of Technology，美国。 智力上的优点。本次研讨会将讨论自组装和定向组装方法的薄膜异质结构的建设，胶体结构，响应的双折射膜和膜。研讨会的主要特点包括：（1）将理论和建模方法整合到自组装的实验科学和工程中;（2）代表亚洲表面自组装材料的最新发展;（3）强调增加年轻教师，博士后助理和研究生的参与。 更广泛的影响。该研讨会旨在汇集来自美国，欧洲和亚洲的领先科学家，材料科学家和工程师，在表面自组装的跨学科领域工作。鼓励学生的参与将使他们能够接触到该领域的最先进的知识，并在与领先的研究人员进行重点讨论期间提高他们对该领域的知识。通过NSF的支持，美国研究生将有权获得旅行费用的经济补偿。